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| 型号： | MPC8241LVR166D |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357 |
| 封装： | 25 X 25 MM, 2.52 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357 |
| 文件页数： | 5/58页 |
| 文件大小： | 853K |
| 代理商： | MPC8241LVR166D |
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MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
13
Electrical and Thermal Characteristics
4.4
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8241. For details, see Section 7.7,
4.5
AC Electrical Characteristics
After fabrication, functional parts are sorted by maximum processor core frequency as shown in Table 7
and tested for conformance to the AC specifications for that frequency. The processor core frequency is
determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals.
Parts are sold by maximum processor core frequency. See Section 8, “Ordering Information.”
Table 6. Thermal Characterization Data
Rating
Thermal Test Board
Description
Symbol
Value 7
(166- and
200-MHz
Parts)
Value 7
(266-MHz
Part)
Unit
Notes
Junction-to-ambient natural
convection
Single-layer board (1s)
RθJA
38
28
°C/W
1, 2
Junction-to-ambient natural
convection
Four-layer board (2s2p)
RθJMA
25
20
°C/W
1, 3
Junction-to-ambient (@200 ft/min) Single-layer board (1s)
RθJMA
31
22
°C/W
1, 3
Junction-to-ambient (@200 ft/min) Four-layer board (2s2p)
RθJMA
22
17
°C/W
1, 3
Junction-to-board (bottom)
Four-layer board (2s2p)
RθJB
17
11
°C/W
4
Junction-to-case (top)
Single-layer board (1s)
RθJC
87
°C/W
5
Junction-to-package top
Natural convection
Ψ
JT
22
°C/W
6
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and EIA/JESD51-2 with the board horizontal.
3. Per EIA/JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per EIA/JESD51-2.
7. Note that the 166- and 200-MHz parts are in a two-layer package and the 266-MHz part is in a four-layer package, which
causes the two package types to have different thermal characterization data.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8241LVR200D | 功能描述:微处理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8241LVR266D | 功能描述:微处理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8241LZQ166D | 功能描述:微处理器 - MPU 166MHz 315.4MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8241LZQ200D | 功能描述:微处理器 - MPU 200MHz 380MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8241LZQ200D | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357 |
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