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参数资料
| 型号： | MPC8241LZP200X |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357 |
| 封装： | 25 X 25 MM, PLASTIC, BGA-357 |
| 文件页数： | 4/56页 |
| 文件大小： | 739K |
| 代理商： | MPC8241LZP200X |
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12
MPC8241 Integrated Processor Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
1.4.2
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8241. For further information, see
1.4.3
AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC8241. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Table 7 and tested for conformance to the AC
specifications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN)
clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core
frequency. See Section 1.9, “Ordering Information.”
Table 7 provides the operating frequency information for the MPC8241 at recommended operating
Table 6. Thermal Characterization Data
Rating
Board Description
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
Single-layer board (1s)
RθJA
40
°C/W
1, 2
Junction-to-ambient natural convection
Four-layer board (2s2p)
RθJMA
25
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
Single-layer board (1s)
RθJMA
32
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
Four-layer board (2s2p)
RθJMA
21
°C/W
1, 3
Junction-to-board (bottom)
Four-layer board (2s2p)
RθJB
15
°C/W
4
Junction-to-case (top)
Single-layer board (1s)
RθJC
7°C/W
5
Junction-to-package top
Natural convection
Ψ
JT
2°C/W
6
Junction-to-package top
200 ft/min
Ψ
JT
3°C/W
6
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and EIA/JESD51-2 with the board horizontal.
3. Per EIA/JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per EIA/JESD51-2.
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