参数资料
型号: MPC8245TZU350D
厂商: Freescale Semiconductor
文件页数: 47/68页
文件大小: 0K
描述: IC MPU 32BIT 350MHZ 352-TBGA
标准包装: 24
系列: MPC82xx
处理器类型: 32-位 MPC82xx PowerQUICC II
速度: 350MHz
电压: 2V
安装类型: 表面贴装
封装/外壳: 352-LBGA
供应商设备封装: 352-TBGA(35x35)
包装: 托盘
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
51
System Design
Figure 28. Die Junction-to-Ambient Resistance
The board designer can choose between several types of heat sinks to place on the MPC8245. Several
commercially-available heat sinks for the MPC8245 are provided by the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
2
4
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8
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16
18
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1.5
22.5
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Am
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ien
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Airflow Velocity (m/s)
No heat sink and high thermal board-level loading of
adjacent components
No heat sink and low thermal board-level loading of
adjacent components
Attached heat sink and high thermal board-level loading of
adjacent components
Attached heat sink and low thermal board-level loading of
adjacent components
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