- 您现在的位置：买卖IC网 > PDF目录45358 > MPC8248CVRTIEA (FREESCALE SEMICONDUCTOR INC) 32-BIT, 400 MHz, RISC PROCESSOR, PBGA516 PDF资料下载
参数资料
| 型号： | MPC8248CVRTIEA |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA516 |
| 封装： | 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-516 |
| 文件页数： | 3/60页 |
| 文件大小： | 918K |
| 代理商： | MPC8248CVRTIEA |
第1页第2页当前第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 1.5
Freescale Semiconductor
11
Thermal Characteristics
4
Thermal Characteristics
Table 6 describes thermal characteristics. Refer to Table 2 for information on a given device’s package.
Discussions of each characteristic are provided in sections 4.1 through 4.7. For the these discussions,
PD =(VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
4.1
Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in C can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (C)
RθJA = package junction-to-ambient thermal resistance (C/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
4
The leakage current is measured for nominal VDDH,VCCSYN, and VDD.
5
MPC8272 and MPC8271 only.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
Junction-to-ambient—
single-layer board 1
1
Assumes no thermal vias
RθJA
27
°C/W
Natural convection
21
1 m/s
Junction-to-ambient—
four-layer board
RθJA
19
°C/W
Natural convection
16
1 m/s
Junction-to-board 2
2
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
RθJB
11
°C/W
—
Junction-to-case 3
3
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
RθJC
8
°C/W
—
Junction-to-package top 4
4
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
RθJT
2
°C/W
—
相关PDF资料 |
PDF描述 |
|---|---|
| MPC8247VRMIBX | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516 |
| MPC8248ZQPIEX | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA516 |
| MPC8248VRMIBX | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516 |
| MPC8248VRTMFX | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA516 |
| MPC8248CVRPIEX | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA516 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8248CVRTIEA | 制造商:Freescale Semiconductor 功能描述:IC PERIPHERAL (MULTIFUNCTION) CONTROLLE |
| MPC8248CZQ | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC8272 PowerQUICC II Family Hardware Specifications |
| MPC8248CZQB | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8248CZQE | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8248CZQI | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
发布紧急采购，3分钟左右您将得到回复。