参数资料
型号: MPC8248ZQTMFX
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, PBGA516
封装: 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-516
文件页数: 6/60页
文件大小: 918K
代理商: MPC8248ZQTMFX
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 1.5
14
Freescale Semiconductor
Power Dissipation
4.7
References
Semiconductor Equipment and Materials International
(415) 964-5111
805 East Middlefield Rd.
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) Specifications
800-854-7179 or
(Available from Global Engineering Documents)
303-397-7956
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.
212–220.
5
Power Dissipation
Table 7 provides preliminary, estimated power dissipation for various configurations. Note that suitable
thermal management is required to ensure the junction temperature does not exceed the maximum
specified value. Also note that the I/O power should be included when determining whether to use a heat
sink. For a complete list of possible clock configurations, refer to Section 7, “Clock Configuration
Table 7. Estimated Power Dissipation for Various Configurations 1
1
Test temperature = 105
° C
Bus
(MHz)
CPM
Multiplication
Factor
CPM
(MHz)
CPU
Multiplication
Factor
CPU
(MHz)
PINT(W)
2, 3
2
PINT = IDD x VDD Watts
3
Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
66.7 MHz = 0.35 W (nominal), 0.4 W (maximum)
83.3 MHz = 0.4 W (nominal), 0.5 W (maximum)
100 MHz = 0.5 W (nominal), 0.6 W (maximum)
133 MHz = 0.7 W (nominal), 0.8 W (maximum)
Vddl 1.5 Volts
Nominal
Maximum
66.67
3
200
4
266
1
1.2
100
2
200
3
300
1.1
1.3
100
2
200
4
400
1.3
1.5
133
2
267
3
400
1.5
1.8
相关PDF资料
PDF描述
MSP430F2254TRHAT 16-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PQCC40
MSP430F2274TDAR 16-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PDSO38
MC3S12XEP100F1VVLR 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PBGA208
MC9S12XD64CAA 16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP80
MB95F562HWQN-G-JNERE1 MICROCONTROLLER, PQCC32
相关代理商/技术参数
参数描述
MPC8250 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Hardware Specifications
MPC8250_05 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Hardware Specifications
MPC8250ACVRIHBB 制造商:Rochester Electronics LLC 功能描述:- Bulk
MPC8250ACVRIHBC 功能描述:微处理器 - MPU PWR QUICC II HIP4CVR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8250ACVVMHBC 功能描述:微处理器 - MPU PQ 2 HIP4 REV-C NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324