参数资料
型号: MPC8250ACZQIHBC
厂商: MOTOROLA INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, PBGA516
封装: 27 X 27 MM, 1.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516
文件页数: 49/73页
文件大小: 885K
代理商: MPC8250ACZQIHBC
MOTOROLA
MPC8250 Hardware Specications
53
Package Description
1.5
Package Description
The following sections provide the package parameters and mechanical dimensions.
1.5.1
Package Parameters
Package parameters are provided in Table 22.
Core Power
L3, V4, W3, AC11, AD11, AB15,
U25, T24, J24, H25, F23, B19,
D17, C17, D10, C10
Ground
A2, B1, B2, A5, C5, C18, D4, D6,
G2, L4, P1, R1, R4, AC4, AE7,
AC23, Y25, N24, J23, A23, D23,
D20, E18, A13, A16, K10, K11,
K12, K13, K14, K15, K16, K17,
L10, L11, L12, L13, L14, L15, L16,
L17, M10, M11, M12, M13, M14,
M15, M16, M17, N10, N11, N12,
N13, N14, N15, N16, N17, P10,
P11, P12, P13, P14, P15, P16,
P17, R10, R11,R12, R13, R14,
R15, R16, R17, T10, T11, T12,
T13, T14, T15, T16, T17, U10,
U11, U12, U13, U14, U15, U16,
U17
1 The default conguration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to congure them as outputs.
2 Must be pulled down or left oating.
3 If PCI is not desired, must be pulled up or left oating.
4 For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide (AN2271/D).
Table 22. Package Parameters
Package
Devices
Outline
(mm)
Type
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
ZU
MPC8250
37.5 x 37.5
TBGA
480
1.27
1.55
VR
MPC8250VR
27 x 27
PBGA
516
1
2.25
Table 21. MPC8250 VR Package Pinout List (Continued)
Pin Name
Ball
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