参数资料
型号: MPC8250AZQPIBX
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, PBGA516
封装: 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516
文件页数: 25/62页
文件大小: 945K
代理商: MPC8250AZQPIBX
MPC8250 Hardware Specifications, Rev. 2
Freescale Semiconductor
31
Pinout
Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
Figure 14. Side View of the TBGA Package
Table 20 shows the pinout list of the TBGA package of the MPC8250. Table 19 defines the conventions
and acronyms used in Table 20.
Table 19. Symbol Legend
Symbol
Meaning
OVERBAR
Signals with overbars, such as TA, are active low.
MII
Indicates that a signal is part of the media independent interface.
Table 20. MPC8250 TBGA Package Pinout List
Pin Name
Ball
BR
W5
BG
F4
ABB/IRQ2
E2
TS
E3
A0
G1
A1
H5
A2
H2
A3
H1
A4
J5
A5
J4
A6
J3
A7
J2
A8
J1
A9
K4
A10
K3
A11
K2
A12
K1
Soldermask
Copper Traces
Die
Copper Heat Spreader
(Oxidized for Insulation)
1.27 mm Pitch
Glob-Top Dam
Wire Bonds
Etched
Pressure Sensitive
Die
Glob-Top Filled Area
Polymide Tape
Cavity
Adhesive
Attach
View
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