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参数资料
型号： MPC8250AZUPIBC
厂商： Freescale Semiconductor
文件页数： 55/62页
文件大小： 0K
描述： IC MPU POWERQUICC II 480-TBGA
标准包装： 21
系列： MPC82xx
处理器类型： 32-位 MPC82xx PowerQUICC II
速度： 300MHz
电压： 2V
安装类型： 表面贴装
封装/外壳： 480-LBGA
供应商设备封装： 408-TBGA（37.5x37.5）
包装： 托盘
MPC8250 Hardware Specifications, Rev. 2
Freescale Semiconductor
59
Ordering Information
6
Ordering Information
Figure 19 provides an example of the Freescale part numbering nomenclature for the MPC8250. In
addition to the processor frequency, the part numbering scheme also consists of a part modifier that
indicates any enhancement(s) in the part from the original production design. Each part number also
contains a revision code that refers to the die mask revision number and is specified in the part numbering
scheme for identification purposes only. For more information, contact your local Freescale sales office.
Figure 19. Freescale Part Number Key
7
Document Revision History
Table 24 provides a revision history for this template.
Table 24. Document Revision History
Revision
Date
Substantive Changes
2
7/2009
Updated TBGA and PBGA packaging information.
1
3/2005
Document template update
0.9
8/2003
Table 2: Modification to supply voltage ranges reflected in notes 2, 3, and 4
Addition of VCCSYN to “Note: Core, PLL, and I/O Supply Voltages” following Table 2
Addition of Figure 2
Addition of note 1 to Table 3
Table 4: Changes to
θJA. Addition of θJB and θJC
Table 7, Figure 8: Addition of sp42a/sp43a
Figure 3 through Figure 8: Addition of notes or modifications
Table 9: Change to sp10
Table 14, Table 16, and Table 18: Removal of PLL bypass mode from clock tables
Table 20 and Table 22: Addition of note 1
Addition of SPICLK to PC19 in Table 20 and Table 22. It is documented correctly in the
MPC8260 PowerQUICC II Family Reference Manual but had previously been omitted from
Table 20 and Table 22.
0.8
11/2002 Table 22, “VR Pinout”: Addition of C18 to the Ground (GND) pin list (page 53)
0.7
10/2002 Table 22, “VR Pinout”: Addition of L3 to the Core (VDDx) pin list (page 53)
Product Code
Device Number
Process Technology
Package
Processor Frequency
Die Revision Level
MPC 8250 A C
Temperature Range
ZU XXX
(CPU/CPM/Bus)
X
(A = 0.25 micron)
(Blank = 0 to 105 °C
C = –40 to 105 °C)
ZU = 480 TBGA
ZO = 516 PBGA
VV = 480 TBGA (Pb free)
VR = 516 PBGA (Pb free)
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MPC8255ACVVMHBB 功能描述:微处理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8255ACVVMIBB 功能描述:微处理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8255ACZUMHBB 功能描述:微处理器 - MPU POWERQUICC II HIP4 REV B RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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