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参数资料
| 型号： | MPC8255ZUIGAXXX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA480 |
| 封装： | 37.50 X 37.50 MM, 1.27 MM PITCH, TBGA-480 |
| 文件页数： | 3/40页 |
| 文件大小： | 1069K |
| 代理商： | MPC8255ZUIGAXXX |
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MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 1.3
Freescale Semiconductor
11
Electrical and Thermal Characteristics
2.3.1
Layout Practices
Each VCC pin should be provided with a low-impedance path to the board’s power supply. Each ground
pin should likewise be provided with a low-impedance path to ground. The power supply pins drive
distinct groups of logic on chip. The VCC power supply should be bypassed to ground using at least four
0.1 F by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads
and associated printed circuit traces connecting to chip VCC and ground should be kept to less than half an
inch per capacitor lead. A four-layer board is recommended, employing two inner layers as VCC and GND
planes.
All output pins on the MPC8260 have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize overdamped conditions and reflections caused by these
fast output switching times. This recommendation particularly applies to the address and data buses.
Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be
inputs during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
Table 5 provides preliminary, estimated power dissipation for various configurations. Note that suitable
thermal management is required for conditions above PD = 3W (when the ambient temperature is 70° C or
greater) to ensure the junction temperature does not exceed the maximum specified value. Also note that
the I/O power should be included when determining whether to use a heat sink.
2.4
AC Electrical Characteristics
The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and
inputs for the 66 MHz MPC8260 device. Note that AC timings are based on a 50-pf load. Typical output
buffer impedances are shown in Table 6.
Table 5. Estimated Power Dissipation for Various Configurations 1
1
Test temperature = room temperature (25
° C)
Bus
(MHz)
CPM
Multiplier
CPU
Multiplier
CPM
(MHz)
CPU
(MHz)
PINT (W)
2
2
PINT = IDD x VDD Watts
Vddl
2.4
2.5
2.6
2.7
2.8 3
3
2.8 Vddl does not apply to HiP3 Rev C silicon.
33.3
4
133.3
2.04
2.14
2.26
2.38
2.50
50.0
2
3
100
150.0
2.21
2.30
2.45
2.59
2.69
66.7
2
2.5
133.3
166.7
2.47
2.62
2.74
2.88
3.02
66.7
2.5
166.7
2.57
2.69
2.83
2.98
3.12
66.7
2
3
133.3
200.0
2.81
2.95
3.12
3.29
3.43
66.7
2.5
3
166.7
200.0
2.88
3.05
3.22
3.38
3.55
50.0
3
4
150
200.0
2.83
3.00
3.14
3.31
3.48
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8260 | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8260A | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC⑩ II Integrated Communications Processor Hardware Specifications |
| MPC8260ACVR | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8260ACVVMHBB | 功能描述:微处理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8260ACVVMIBB | 功能描述:微处理器 - MPU PQ II HIP4 REV B RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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