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参数资料
| 型号： | MPC8260ACZUIFBX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA480 |
| 封装： | 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 |
| 文件页数： | 4/50页 |
| 文件大小： | 841K |
| 代理商： | MPC8260ACZUIFBX |
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MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2.0
12
Freescale Semiconductor
Electrical and Thermal Characteristics
2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and
TJ is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
2 The leakage current is measured for nominal VDD, VCCSYN, and VDD.
3 MPC8265 and MPC8266 only.
Table 4. Thermal Characteristics for 480 TBGA Package
Characteristics
Symbol
Value
Unit
Air Flow
Junction to ambient
θJA
131
1 Assumes a single layer board with no thermal vias
°C/W
NC2
2 Natural convection
1 m/s
113
3 Assumes a four layer board
NC
83
1 m/s
Junction to board4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
θJB
4
°C/W
—
Junction to case5
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
θJC
1.1
°C/W
—
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