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型号： MPC8260ACZUMHBB
厂商： Freescale Semiconductor
文件页数： 44/50页
文件大小： 0K
描述： IC MPU POWERQUICC II 480-TBGA
标准包装： 21
系列： MPC82xx
处理器类型： 32-位 MPC82xx PowerQUICC II
速度： 266MHz
电压： 2V
安装类型： 表面贴装
封装/外壳： 480-LBGA
供应商设备封装： 408-TBGA（37.5x37.5）
包装： 托盘
配用： MPC8260ADS-TCOM-ND - BOARD DEV ADS POWERQUICC II
MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2.0
Freescale Semiconductor
49
Document Revision History
0.9
8/2003
Note: In revision 0.3, sp30 (Table 10) was changed. This change was not previously recorded in this
“Document Revision History” Table.
Removal of “HiP4 PowerQUICC II Documentation” table. These supplemental specifications have
been replaced by revision 1 of the
MPC8260 PowerQUICC II Family Reference Manual.
Figure 1 and Section 1, “Features”: Addition of MPC8255 notes
Addition of Figure 2
Addition of VCCSYN to “Note: Core, PLL, and I/O Supply Voltages” following Table 2
Addition of note 1 to Table 3
Table 4: Changes to
θJA and θJB and θJC.
Addition of notes or modifications to Figure 6, Figure 7, and Figure 8
Table 9: Change of sp10.
Addition of Table 15.
Addition of note 2 to Table 21
Table 21: Addition of FCC2 Rx and Tx [3,4] to CPM pins PD7, PD18, PD19, and PD29. Also, the
addition of SPICLK to PC19. They are documented correctly in the parallel I/O ports chapter in the
MPC8260 PowerQUICC II Family Reference Manual but had previously been omitted from
Table 21.
0.8
1/2003
Table 2: Modification to supply voltage ranges reflected in notes 2, 3, and 4.
Table 4: Addition of
θJB and θJC.
Table 7, Figure 8: Addition of sp42a/sp43a.
Figure 3, Figure 4: Addition of note for FCC output.
Figure 5, Figure 6, Figure 7: Addition of notes.
Table 14, Table 17, and Table 19: Removal of PLL bypass mode from clock tables.
0.7
5/2002
Section 1, “Features”: minimum supported core frequency of 150 MHz
Section 1, “Features”: updated performance values (under “Dual-issue integer core”)
Table 2: Note 2 (changes in italics): “...
less than or equal to 233 MHz, 166 MHz CPM...”
Table 2: Addition of note 3.
0.6
3/2002
Table 21: Modified notes to pins AE11 and AF25.
0.5
3/2002
Table 21: Modified notes to pins AE11 and AF25.
Table 21: Addition of note to pins AA1 and AG4 (Therm0 and Therm1).
0.4
2/2002
Note 2 for Table 2 (changes in italics): “...greater than
or equal to 266 MHz, 200 MHz CPM...”
Table 19: Core and bus frequency values for the following ranges of MODCK_HMODCK: 0011_000
to 0011_100 and 1011_000 to 1011_1000
Table 21: Notes added to pins at AE11, AF25, U5, and V4.
0.3
11/2001
Table 1: note 3
Section 2.1: Removal of “Warning” recommending use of bootstrap diodes. They are not needed.
Table 9: Change to sp12.
Table 10: Change to sp32.
Note 2 for Table 16 and Table 17
Addition of note at beginning of Section 3.2
Note 1 for Table 18 and Table 19
Table 21: Additions to B27, C28, D25, D27, E26, G29, H26–28, N25, P29, AF25, AA25, AB27
0.2
11/2001
Revision of Table 5, “Power Dissipation”
Modifications to Figure 9, Table 2,Table 10, Table 11, and Table 18
Modification to pinout diagram, Figure 13
Additional revisions to text and figures throughout
0.1
8/2001
Table 8: Change to sp20/sp21.
0
—
Initial version
Table 23. Document Revision History (continued)
Revision
Date
Substantive Changes
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