参数资料
型号: MPC8266AZUIHBX
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, PBGA480
封装: 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
文件页数: 50/52页
文件大小: 884K
代理商: MPC8266AZUIHBX
MPC8260A PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 1.1
Freescale Semiconductor
7
Electrical and Thermal Characteristics
— Hot-Swap friendly (supports the Hot Swap Specification as defined by PICMG 2.1 R1.0
August 3, 1998)
— Support for 66 MHz, 3.3 V specification
— 60x-PCI bus core logic which uses a buffer pool to allocate buffers for each port
— Makes use of the local bus signals, so there is no need for additional pins
2
Electrical and Thermal Characteristics
This section provides AC and DC electrical specifications and thermal characteristics for the MPC826xA.
2.1
DC Electrical Characteristics
This section describes the DC electrical characteristics for the MPC826xA. Table 1 shows the maximum
electrical ratings.
Table 1. Absolute Maximum Ratings(1)
Notes:
1. Absolute maximum ratings are stress ratings only; functional operation (see Table 2) at the maximums is not
guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage.
Rating
Symbol
Value
Unit
Core supply voltage(2)
2. Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V at any time, including during power-on reset.
VDD
-0.3 – 2.5
V
PLL supply voltage2.
VCCSYN
-0.3 – 2.5
V
I/O supply voltage(3)
3. Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH
should not exceed VDD/VCCSYN by more than 2.5 V during normal operation.
VDDH
-0.3 – 4.0
V
Input voltage(4)
4. Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including during power-on reset.
VIN
GND(-0.3) – 3.6
V
Junction temperature
Tj
120
°C
Storage temperature range
TSTG
(-55) – (+150)
°C
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