参数资料
型号: MPC8270VRMIBA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 66.67 MHz, RISC PROCESSOR, PBGA516
封装: 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-516
文件页数: 127/156页
文件大小: 1680K
代理商: MPC8270VRMIBA
72
MPC8280 PowerQUICC II Family Hardware Specications
MOTOROLA
Package Description
9.2
Mechanical Dimensions
Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA (ZU)
package. Refer to Table 2.
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA
Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the 516 PBGA (VR/ZQ)
packages.
Dim
Millimeters
Min
Max
A
1.45
1.65
A1
0.60
0.70
A2
0.85
0.95
A3
0.25
b
0.65
0.85
D
37.50 BSC
D1
35.56 REF
e
1.27 BSC
E
37.50 BSC
E1
35.56 REF
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter,
parallel to primary data A.
4. Primary data A and the seating
plane are dened by the spherical
crowns of the solder balls.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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相关代理商/技术参数
参数描述
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