- 您现在的位置：买卖IC网 > PDF目录80463 > MPC8271VRMIBX (FREESCALE SEMICONDUCTOR INC) 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516 PDF资料下载
参数资料
| 型号： | MPC8271VRMIBX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA516 |
| 封装： | 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-516 |
| 文件页数： | 5/60页 |
| 文件大小： | 918K |
| 代理商： | MPC8271VRMIBX |
第1页第2页第3页第4页当前第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 1.5
Freescale Semiconductor
13
Thermal Characteristics
4.4
Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple
two-resistor model can be used with the thermal simulation of the application, or a more accurate and
complex model of the package can be used in the thermal simulation.
4.5
Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
Ψ
JT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per JEDEC JESD51-2 specification using a 40 gauge
type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over 1 mm of wire extending from the junction. The thermocouple wire is
placed flat against the case to avoid measurement errors caused by cooling effects of the thermocouple
wire.
4.6
Layout Practices
Each VDD and VDDH pin should be provided with a low-impedance path to the board’s power supplies.
Each ground pin should likewise be provided with a low-impedance path to ground. The power supply pins
drive distinct groups of logic on chip. The VDD and VDDH power supplies should be bypassed to ground
using by-pass capacitors located as close as possible to the four sides of the package. For filtering high
frequency noise, a capacitor of 0.1uF on each VDD and VDDH pin is recommended. Further, for medium
frequency noise, a total of 2 capacitors of 47uF for VDD and 2 capacitors of 47uF for VDDH are also
recommnded. The capacitor leads and associated printed circuit traces connecting to chip VDD, VDDH
and ground should be kept to less than half an inch per capacitor lead. Boards should employ separate inner
layers for power and GND planes.
All output pins on the MPC8272 have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized to minimize overdamped conditions and reflections caused by these fast
output switching times. This recommendation particularly applies to the address and data buses. Maximum
PC trace lengths of six inches are recommended. Capacitance calculations should consider all device loads
as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing
becomes especially critical in systems with higher capacitive loads because these loads create higher
transient currents in the VDD and GND circuits. Pull up all unused inputs or signals that will be inputs
during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
相关PDF资料 |
PDF描述 |
|---|---|
| MPC8548ECPXAQGB | 32-BIT, 1000 MHz, MICROPROCESSOR, PBGA783 |
| MC9S12P64VFTR | 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, QCC48 |
| MK3727JLF | 36 MHz, OTHER CLOCK GENERATOR, PDSO8 |
| MK3732-17SILFTR | 49.46 MHz, OTHER CLOCK GENERATOR, PDSO16 |
| MC68HC05C8AFNE | 8-BIT, MROM, 2.1 MHz, MICROCONTROLLER, PQCC44 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8271VRP | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8271VRPIEA | 功能描述:微处理器 - MPU 300 MHz 570 MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8271VRT | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8271VRTIEA | 功能描述:微处理器 - MPU 400 MHz 760 MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8271VRTMFA | 功能描述:微处理器 - MPU PQ27E A W/O TALITOS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
发布紧急采购，3分钟左右您将得到回复。