参数资料
型号: MPC8271ZQTMFA
厂商: Freescale Semiconductor
文件页数: 57/61页
文件大小: 0K
描述: IC MPU POWERQUICC II 516-PBGA
标准包装: 40
系列: MPC82xx
处理器类型: 32-位 MPC82xx PowerQUICC II
速度: 400MHz
电压: 1.5V
安装类型: 表面贴装
封装/外壳: 516-BBGA
供应商设备封装: 516-FPBGA(27x27)
包装: 托盘
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
60
Freescale Semiconductor
Document Revision History
0.2
12/2003
Table 4: Modification of VDD and VCCSYN to 1.45–1.60 V
Table 8: Addition of note 2 regarding TRST and PORESET (see VIH row of Table 8)
Table 8 and Table 21: Addition of muxed signals
CPCI_HS_ES to PCI_REQ1 (AF14)
CPCI_HS_LED to PCI_GNT1 (AE13)
CPCI_HS_ENUM to PCI_GNT2 (AF21)
Table 8 and Table 21: Modification of PCI signal names for consistency with PCI signal names
on other PowerQUICC II devices:
PCI_CFG0 (PCI_HOST_EN) (AC21)
PCI_CFG1 (PCI_ARB_EN) (AE22)
PCI_CFG2 (DLL_ENABLE) (AE23)
PCI_PAR (AF12)
PCI_FRAME (AD15)
PCI_TRDY(AF16)
PCI_IRDY (AF15)
PCI_STOP (AE15)
DEVSEL (AE14)
PCI_IDSEL (AC17)
PCI_PERR (AD14)
PCI_SERR (AD13)
PCI_REQ0–2 (AAE20, AF14, AB14)
PCI_GNT0–2 (AD20, AE13, AF21)
PCI_RST (AF22)
PCI_INTA (AE21)
PCI_C0-3 (AE12, AF13, AC15, AE18)
PCI_AD0-31
Table 8 and Table 21: Corrected assertion level (added “ “) PCI_HOST_EN (AC21) and
PCI_ARB_EN (AE22)
Table 7: Addition of RθJT and note 4
Sections 4.1–4.5 and 4.7 on thermal characteristics: New
Section 7, “Clock Configuration Modes”: Modification to first paragraph. Note that
PCI_MODCK is a bit in the Hard Reset Configuration Word. It is not an input signal as it is in
the MPC8280 Family and MPC8260 Family.
Table 21: Addition of note 2 to TRST (E21) and PORESET (C24)
Table 21: Removal of Thermal0 (D19) and Thermal1(J3). These pins are now “No connects.”
Note 4 unchanged.
Table 21: Removal of Spare0 (AD24). This pin is now a “No connect.” Note 5 unchanged.
Table 21: Addition of PCI_MODE (AD22). This pin was previously listed as “Ground.” Addition
of note 1.
0.1
9/2003
Addition of the MPC8271 and the MPC8247 (these devices do not have a security engine)
Table 8: Addition of note 2 to VIH
Table 8: Changed IOL for 60x signals to 6.0 mA
Modification of note 1 for Table 17, Table 18, Table 19, and Table 20
Table 21: Addition of ball AD9 to GND. In rev 0 of this document, AD8 was listed as assigned
to both CS5 and GND. AD8 is only assigned to CS5.
Table 21: Addition of note 4 to Thermal0 (D19) and Thermal1(J3)
Addition of ZQ package code to Figure 15
0
5/2003
NDA release
Table 23. Document Revision History (continued)
Revision
Date
Substantive Changes
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