参数资料
型号: MPC8272VRP
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, EPROM, 300 MHz, RISC MICROCONTROLLER, PBGA516
封装: 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-516
文件页数: 9/61页
文件大小: 394K
代理商: MPC8272VRP
MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3
Freescale Semiconductor
17
Power Dissipation
4.7
References
Semiconductor Equipment and Materials International(415) 964-5111
805 East Middlefield Rd.
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) Specifications800-854-7179 or
(Available from Global Engineering Documents)303-397-7956
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.
212–220.
5
Power Dissipation
This table provides preliminary, estimated power dissipation for various configurations. Note that suitable
thermal management is required to ensure the junction temperature does not exceed the maximum
specified value. Also note that the I/O power should be included when determining whether to use a heat
sink. For a complete list of possible clock configurations, see Section 7, “Clock Configuration Modes.”
Table 8. Estimated Power Dissipation for Various Configurations1
1 Test temperature = 105° C
Bus
(MHz)
CPM
Multiplication
Factor
CPM
(MHz)
CPU
Multiplication
Factor
CPU
(MHz)
PINT(W)
2,3
2 P
INT = IDD x VDD Watts
3 Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
66.7 MHz = 0.35 W (nominal), 0.4 W (maximum)
83.3 MHz = 0.4 W (nominal), 0.5 W (maximum)
100 MHz = 0.5 W (nominal), 0.6 W (maximum)
133 MHz = 0.7 W (nominal), 0.8 W (maximum)
Vddl 1.5 Volts
Nominal
Maximum
66.67
3
200
4
266
1
1.2
100
2
200
3
300
1.1
1.3
100
2
200
4
400
1.3
1.5
133
2
267
3
400
1.5
1.8
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