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参数资料
| 型号： | MPC8272ZQTMFX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA516 |
| 封装： | 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-516 |
| 文件页数： | 51/60页 |
| 文件大小： | 746K |
| 代理商： | MPC8272ZQTMFX |
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MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 2
Freescale Semiconductor
55
Package
9Package
Figure 13 shows the side profile of the PBGA package.
Figure 13. Side View of the PBGA Package Remove
Table 21 provides package parameters. Figure 14 provides the mechanical dimensions and bottom surface
nomenclature of the 516 PBGA package.
NOTE: Temperature Reflow for the VR Package
In the VR package, sphere composition is lead-free (refer to Table 2). This
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Users should consult “Freescale
PowerQUICC II Pb-Free Packaging Information”
(MPC8250PBFREEPKG) available at www.freescale.com.
Table 21. Package Parameters
Code
Type
Outline
(mm)
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
VR, ZQ
PBGA
27 x 27
516
1
2.25
Die
Transfer molding compound
1 mm pitch
Wire bonds
attach
DIE
Ball bond
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
Plated substrate via
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