参数资料
型号: MPC8280CZUUPE
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 100 MHz, RISC PROCESSOR, PBGA480
封装: 37 X 37 MM, 1.27 MM PITCH, FTBGA-480
文件页数: 126/156页
文件大小: 1680K
代理商: MPC8280CZUUPE
MOTOROLA
MPC8280 PowerQUICC II Family Hardware Specications
71
Package Description
9
Package Description
The following sections provide the package parameters and mechanical dimensions.
9.1
Package Parameters
Package parameters are provided in Table 23.
1 Should be tied to VDDH via a 2K external pull-up resistor.
2 The default conguration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to congure them as outputs.
3 Must be pulled down or left oating.
4 If PCI is not desired, must be pulled up or left oating.
5 Sphere is not connected to die.
6 GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate
ground signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in
Section 4.3, “Layout Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can
leave the pin connected to GND with the noise ltering capacitors.
7 XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no
need for external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in
which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
Table 23. Package Parameters
Package
Devices
Outline
(mm)
Type
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
ZU
MPC8280
MPC8270
37.5 x 37.5
TBGA
480
1.27
1.55
VR
MPC8275VR
MPC8270VR
27 x 27
PBGA
516
1
2.25
ZQ
MPC8275ZQ
MPC8270ZQ
27 x 27
PBGA
516
1
2.25
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Freescale Semiconductor, Inc.
For More Information On This Product,
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