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参数资料
| 型号： | MPC8280ZUBX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 66 MHz, RISC PROCESSOR, PBGA480 |
| 封装： | 37.5 X 37.5 MM, 1.55 MM, 1.27 MM PITCH, TBGA-480 |
| 文件页数： | 73/83页 |
| 文件大小： | 618K |
| 代理商： | MPC8280ZUBX |
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MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2
Freescale Semiconductor
75
Package Description
9
Package Description
This figure shows the side profile of the TBGA package to indicate the direction of the top surface view.
Figure 15. Side View of the TBGA Package
This figure shows the side profile of the PBGA package to indicate the direction of the top surface view.
Figure 16. Side View of the PBGA Package Remove
3 Must be pulled down or left floating.
4 If PCI is not desired, must be pulled up or left floating.
5 Sphere is not connected to die.
6 GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate ground
signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in Section 4.6, “Layout
Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to
GND with the noise filtering capacitors.
7 XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no need for
external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in which the
MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
Soldermask
Copper Traces
Die
Copper Heat Spreader
(Oxidized for Insulation)
1.27 mm Pitch
Glob-Top Dam
Wire Bonds
Etched
Pressure Sensitive
Die
Glob-Top Filled Area
Polymide Tape
Cavity
Adhesive
Attach
View
Die
Transfer molding compound
1 mm pitch
Wire bonds
attach
DIE
Ball bond
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
Plated substrate via
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8280ZUE | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8280ZUI | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8280ZUM | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8280ZUP | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II⑩ Family Hardware Specifications |
| MPC8280ZUQLDA | 功能描述:微处理器 - MPU PQ II HIP 7 REV A RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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