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参数资料
| 型号： | MPC8306SVMABDCA |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 133 MHz, RISC PROCESSOR, PBGA369 |
| 封装： | 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 |
| 文件页数： | 62/71页 |
| 文件大小： | 452K |
| 代理商： | MPC8306SVMABDCA |
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MPC8306S PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0
Freescale Semiconductor
65
System Design Information
21.2
Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force.
If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic
surfaces and its performance verified under the application requirements.
21.2.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
interface.
From this case temperature, the junction temperature is determined from the junction-to-case thermal
resistance using the following equation:
TJ = TC +(RJC PD)
Eqn. 5
where:
TC = case temperature of the package (C)
RJC = junction-to-case thermal resistance (C/W)
PD = power dissipation (W)
22 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8306S.
22.1
System Clocking
The MPC8306S includes three PLLs.
The system PLL (AVDD2) generates the system clock from the externally supplied SYS_CLK_IN
input. The frequency ratio between the system and SYS_CLK_IN is selected using the system PLL
ratio configuration bits as described in Section 20.2, “System PLL Configuration.”
The e300 core PLL (AVDD3) generates the core clock as a slave to the system clock. The frequency
ratio between the e300 core clock and the system clock is selected using the e300 PLL ratio
configuration bits as described in Section 20.3, “Core PLL Configuration.”
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8306SVMACDC | 制造商:Freescale Semiconductor 功能描述:MPC8306SVMACDC - Bulk |
| MPC8306SVMACDCA | 功能描述:微处理器 - MPU E300 MP 200 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8306SVMADDC | 制造商:Freescale Semiconductor 功能描述:MPC8306SVMADDC - Bulk |
| MPC8306SVMADDCA | 功能描述:微处理器 - MPU E300 MP 266 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8306SVMADDCA | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 266 MHz 369-LFBGA |
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