参数资料
型号: MPC8313CVRAFF
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 333 MHz, MICROPROCESSOR, PBGA516
封装: 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516
文件页数: 82/100页
文件大小: 1247K
代理商: MPC8313CVRAFF
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 3
82
Freescale Semiconductor
Thermal
20.3
Example Clock Frequency Combinations
Table 69 shows several possible frequency combinations that can be selected based on the indicated input
reference frequencies, with RCWLR[LBCM] = 0 and RCWLR[DDRCM] =1, such that the LBC operates
with a frequency equal to the frequency of csb_clk and the DDR controller operates at twice the frequency
of csb_clk.
21 Thermal
This section describes the thermal specifications of the MPC8313E.
21.1
Thermal Characteristics
Table 70 provides the package thermal characteristics for the 516, 27
× 27 mm TEPBGAII.
Table 69. System Clock Frequencies
LBC(lbc_clk)
e300 Core(core_clk)
SYS_
CLK_IN/
PCI_CLK
SPMF1
1 System PLL multiplication factor.
VCOD2
2 System PLL VCO divider.
VCO3
3 When considering operating frequencies, the valid core VCO operating range of 400–800 MHz must not be violated.
CSB
(
csb_clk)4
4 Due to erratum eTSEC40, csb_clk frequencies of less than 133 MHz do not support gigabit Ethernet data rates. The core
frequency must be 333 MHz for gigabit Ethernet operation. This erratum will be fixed in revision 2 silicon.
DDR
(ddr_clk)
/2
/4
/8
USB
ref5
5 Frequency of USB PLL input reference.
× 1
× 1.5 × 2 × 2.5 × 3
25.0
6
2
600.0
150.0
300.0
37.5
18.8
Note 6
6 USB reference clock must be supplied from a separate source as it must be 24 or 48 MHz, the USB reference must be
supplied from a separate external source using USB_CLK_IN.
150.0
225
300
375
25.0
5
2
500.0
125.0
250.0
62.5 31.25 15.6
Note 6
125.0
188
250
313
375
33.3
5
2
666.0
166.5
333.0
41.63 20.8
Note 6
166.5
250
333
33.3
4
2
532.8
133.2
266.4
66.6
33.3
16.7
Note 6
133.2
200
266
333
400
48.0
3
2
576.0
144.0
288.0
36
18.0
48.0
144.0
216
288
360
66.7
2
533.4
133.3
266.7
66.7 33.34 16.7
Note 6
133.3
200
267
333
400
Table 70. Package Thermal Characteristics for TEPBGAII
Characteristic
Board Type
Symbol
TEPBGA II
Unit
Notes
Junction-to-ambient natural convection
Single layer board (1s)
RθJA
25
°C/W
1, 2
Junction-to-ambient natural convection
Four layer board (2s2p)
RθJA
18
°C/W
1, 2, 3
Junction-to-ambient (@200 ft/min)
Single layer board (1s)
RθJMA
20
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
Four layer board (2s2p)
RθJMA
15
°C/W
1, 3
Junction-to-board
RθJB
10
°C/W
4
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相关代理商/技术参数
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MPC8313CVRAFFA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications
MPC8313CVRAFFB 功能描述:微处理器 - MPU PBGA W/O ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8313CVRAFFB 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 333MHZ 516-PBGA
MPC8313CVRAFFC 功能描述:微处理器 - MPU 8313 REV2.2 NO ENC EXT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8313CVRAGDB 功能描述:微处理器 - MPU PBGA W/O ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324