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| 型号： | MPC8313CVRAFF |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 53/99页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC II PRO 516PBGA |
| 标准包装： | 40 |
| 系列： | MPC83xx |
| 处理器类型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 333MHz |
| 电压： | 0.95 V ~ 1.05 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 516-BBGA 裸露焊盘 |
| 供应商设备封装： | 516-PBGAPGE（27x27） |
| 包装： | 托盘 |
| 配用： | MPC8313E-RDB-ND - BOARD PROCESSOR |
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MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
57
This table shows the PCI AC timing specifications at 33 MHz.
This figure provides the AC test load for PCI.
Figure 48. PCI AC Test Load
Clock to output high impedance
tPCKHOZ
—14
ns
2, 3
Input setup to clock
tPCIVKH
3.0
—
ns
2, 4
Input hold from clock
tPCIXKH
0
—
ns
2, 4
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing
(PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference
(K) going to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset
(R) went high (H) relative to the frame signal (F) going to the valid (V) state.
2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications.
3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
through the component pin is less than or equal to the leakage current specification.
4. Input timings are measured at the pin.
Table 52. PCI AC Timing Specifications at 33 MHz
Parameter
Symbol1
Min
Max
Unit
Note
Clock to output valid
tPCKHOV
—11
ns
2
Output hold from clock
tPCKHOX
2—
ns
2
Clock to output high impedance
tPCKHOZ
—14
ns
2, 3
Input setup to clock
tPCIVKH
3.0
—
ns
2, 4
Input hold from clock
tPCIXKH
0—
ns
2, 4
Notes:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with
respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going to
the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went high (H)
relative to the frame signal (F) going to the valid (V) state.
2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications.
3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered through
the component pin is less than or equal to the leakage current specification.
4. Input timings are measured at the pin.
Table 51. PCI AC Timing Specifications at 66 MHz (continued)
Parameter
Symbol1
Min
Max
Unit
Note
Output
Z0 = 50
NVDD/2
RL = 50
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8313CVRAFFA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8313CVRAFFB | 功能描述:微处理器 - MPU PBGA W/O ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8313CVRAFFB | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 333MHZ 516-PBGA |
| MPC8313CVRAFFC | 功能描述:微处理器 - MPU 8313 REV2.2 NO ENC EXT RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8313CVRAGDB | 功能描述:微处理器 - MPU PBGA W/O ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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