参数资料
型号: MPC8347ECVVADFB
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266 MHz, MICROPROCESSOR, PBGA672
封装: 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672
文件页数: 82/98页
文件大小: 1084K
代理商: MPC8347ECVVADFB
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Freescale Semiconductor
83
Thermal
20 Thermal
This section describes the thermal specifications of the MPC8347EA.
20.1
Thermal Characteristics
Table 65 provides the package thermal characteristics for the 672 35
× 35 mm TBGA of the MPC8347EA.
306
0011
0000110
66
200
600
405
0100
0000101
66
266
667
504
0101
0000100
66
333
667
1 The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and
COREPLL settings given in the table.
2 The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.
Table 65. Package Thermal Characteristics for TBGA
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection on single-layer board (1s)
RθJA
14
°C/W
1, 2
Junction-to-ambient natural convection on four-layer board (2s2p)
RθJMA
11
°C/W
1, 3
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
RθJMA
11
°C/W
1, 3
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
RθJMA
8
°C/W
1, 3
Junction-to-ambient (at 2 m/s) on single-layer board (1s)
RθJMA
9
°C/W
1, 3
Junction-to-ambient (at 2 m/s) on four-layer board (2s2p)
RθJMA
7
°C/W
1, 3
Junction-to-board thermal
RθJB
3.8
°C/W
4
Junction-to-case thermal
RθJC
1.7
°C/W
5
Table 64. Suggested PLL Configurations (continued)
Ref
No.1
RCWL
400 MHz Device
533 MHz Device
667 MHz Device
SPMF
CORE
PLL
Input
Clock
Freq
(MHz)2
CSB
Freq
(MHz)
Core
Freq
(MHz)
Input
Clock
Freq
(MHz)2
CSB
Freq
(MHz)
Core
Freq
(MHz)
Input
Clock
Freq
(MHz)2
CSB
Freq
(MHz)
Core
Freq
(MHz)
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