参数资料
型号: MPC8347EZQADFB
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266 MHz, MICROPROCESSOR, PBGA620
封装: 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-620
文件页数: 2/98页
文件大小: 1084K
代理商: MPC8347EZQADFB
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
10
Freescale Semiconductor
Power Characteristics
3
Power Characteristics
The estimated typical power dissipation for the MPC8347EA device is shown in Table 4.
Table 4. MPC8347EA Power Dissipation1
1 The values do not include I/O supply power (OV
DD, LVDD, GVDD) or AVDD. For I/O power values, see Table 5.
Core
Frequency
(MHz)
CSB
Frequency
(MHz)
Typical at TJ = 65
Typical2
,3
2 Typical power is based on a voltage of V
DD = 1.2 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
3 Thermal solutions may need to design to a value higher than typical power based on the end application, T
A target, and I/O
power.
Maximum4
4 Maximum power is based on a voltage of V
DD = 1.2 V, worst case process, a junction temperature of TJ = 105°C, and an
artificial smoke test.
Unit
PBGA
266
1.3
1.6
1.8
W
133
1.1
1.4
1.6
W
400
266
1.5
1.9
2.1
W
133
1.4
1.7
1.9
W
400
200
1.5
1.8
2.0
W
100
1.3
1.7
1.9
W
TBGA
333
2.0
3.0
3.2
W
166
1.8
2.8
2.9
W
400
266
2.1
3.0
3.3
W
133
1.9
2.9
3.1
W
450
300
2.3
3.2
3.5
W
150
2.1
3.0
3.2
W
500
333
2.4
3.3
3.6
W
166
2.2
3.1
3.4
W
533
266
2.4
3.3
3.6
W
133
2.2
3.1
3.4
W
6675,6
5 Typical power is based on a voltage of V
DD = 1.3 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
6 Maximum power is based on a voltage of V
DD = 1.3 V, worst case process, a junction temperature of TJ = 105°C, and an
artificial smoke test.
333
3.5
4.6
5
W
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