参数资料
型号: MPC8347VRAJD
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 533 MHz, RISC PROCESSOR, PBGA620
封装: 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-620
文件页数: 99/102页
文件大小: 1094K
代理商: MPC8347VRAJD
MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
96
Freescale Semiconductor
Document Revision History
8
2/2007
Page 1, updated first paragraph to reflect PowerQUICC II information. Updated note after second
paragraph.
In the features list in Section 1, “Overview,” corrected DDR data rate to show:
266 MHz for PBGA parts for all silicon revisions
333 MHz for DDR for TBGA parts for silicon Rev. 1.x
In Table 5, “MPC8347E Typical I/O Power Dissipation,” added GVDD 1.8-V values for DDR2; added
table footnote to designate rates that apply only to the TBGA package.
In Figure 43, “JTAG Interface Connection,” updated with new figure.
In Section 23, “Ordering Information,” replicated note from document introduction.
In Section 23.1, “Part Numbers Fully Addressed by This Document,” replaced third sentence of first
paragraph directing customer to product summary page for available frequency configuration parts.
Updated back page information.
7
8/2006
Changed all references to revision 2.0 silicon to revision 3.0 silicon.
Changed VIH minimum value in Table 36, “JTAG Interface DC Electrical Characteristics,” to
OVDD –0.3.
In Table 60, “Suggested PLL Configurations,” deleted reference-number rows 902 and 703.
6
3/2006
Section 2, “Electrical Characteristics,” moved to second section and all other section, table, and
figure numbering change accordingly.
Table 7, “CLKIN AC Timing Specifications:” Changed max rise and fall time from 1.2 to 2.3.
Table 22, “GMII Receive AC Timing Specifications:” Changed min tTTKHDX from 0.5 to 1.0.
Table 30, “MII Management AC Timing Specifications:” Changed max value of tMDKHDX from 70 to
170.
Table 34, “Local Bus General Timing Parameters—DLL on:” Changed min tLBIVKH2 from 1.7 to 2.2.
Table 36, “JTAG interface DC Electrical Characteristics:” Changed VIH input high voltage min to 2.0.
Table 54, “Operating Frequencies for TBGA:”
Updated TBD values.
Changed maximum coherent system bus frequency for TBGA 667-MHz device to 333 MHz.
Table 55, “Operating Frequencies for PBGA:”
Updated TBD values.
Changed PBGA maximum coherent system bus frequency to 266 MHz, and maximum DDR
memory bus frequency to 133 MHz.
Table 60, “Suggested PLL Configurations”: Removed some values from suggested PLL
configurations for reference numbers 902, 922, 903, and 923.
Table 67, “Part Numbering Nomenclature”: Updated TBD values in note 1.
Added Table 68, “SVR Settings.”
Added Section 23.2, “Part Marking.”
5
10/2005
In Table 57, updated AAVID 30x30x9.4 mm Pin Fin (natural convection) junction-to-ambient thermal
resistance, from 11 to 10.
4
9/2005
Added Table 2, “MPC8347E Typical I/O Power Dissipation.”
3
8/2005
Table 1: Updated values for power dissipation that were TBD in Revision 2.
2
5/2005
Table 1: Typical values for power dissipation are changed to TBD.
Table 48: Footnote numbering was wrong. THERM0 should have footnote 9 instead of 8.
Table 66. Document Revision History (continued)
Revision
Date
Substantive Change(s)
相关PDF资料
PDF描述
MPC8347ECVRAGD 32-BIT, 400 MHz, RISC PROCESSOR, PBGA620
MPC8347VVADF 32-BIT, 266 MHz, RISC PROCESSOR, PBGA672
MPC8347VVAGD 32-BIT, 400 MHz, RISC PROCESSOR, PBGA672
MPC8347CZQADD 32-BIT, 266 MHz, RISC PROCESSOR, PBGA620
MPC8347ECZUADF 32-BIT, 266 MHz, RISC PROCESSOR, PBGA672
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