参数资料
型号: MPC8349ECVVAJF
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 533 MHz, MICROPROCESSOR, PBGA672
封装: 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672
文件页数: 74/88页
文件大小: 1014K
代理商: MPC8349ECVVAJF
MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10
76
Freescale Semiconductor
Thermal
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
800-522-2800
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield, 53
× 53 × 25 mm pin fin
Natural convection
5.7
Wakefield, 53
× 53 × 25 mm pin fin
1 m/s
3.5
Wakefield, 53
× 53 × 25 mm pin fin
2 m/s
2.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
Natural convection
6.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
1 m/s
4.1
MEI, 75
× 85 × 12 no adjacent board, extrusion
2 m/s
2.8
MEI, 75
× 85 × 12 mm, adjacent board, 40 mm side bypass
1 m/s
3.1
Table 60. Heat Sink and Thermal Resistance of MPC8349E (TBGA) (continued)
Heat Sink Assuming Thermal Grease
Air Flow
35
× 35 mm TBGA
Thermal Resistance
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