参数资料
型号: MPC8349EVVALFB
厂商: Freescale Semiconductor
文件页数: 17/87页
文件大小: 0K
描述: IC MPU POWERQUICC II 672-TBGA
标准包装: 24
系列: MPC83xx
处理器类型: 32-位 MPC83xx PowerQUICC II Pro
速度: 667MHz
电压: 1.3V
安装类型: 表面贴装
封装/外壳: 672-LBGA
供应商设备封装: 672-TBGA(35x35)
包装: 托盘
配用: MPC8349E-MITX-GP-ND - KIT REFERENCE PLATFORM MPC8349E
MPC8349E-MITXE-ND - BOARD REFERENCE FOR MPC8349
MPC8349EA-MDS-PB-ND - KIT MODULAR DEV SYSTEM MPC8349E
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
24
Freescale Semiconductor
Ethernet: Three-Speed Ethernet, MII Management
8.2.1.1
GMII Transmit AC Timing Specifications
Table 25 provides the GMII transmit AC timing specifications.
Figure 9 shows the GMII transmit AC timing diagram.
Figure 9. GMII Transmit AC Timing Diagram
8.2.1.2
GMII Receive AC Timing Specifications
Table 26 provides the GMII receive AC timing specifications.
Table 25. GMII Transmit AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
GTX_CLK clock period
tGTX
—8.0
ns
GTX_CLK duty cycle
tGTXH/tGTX
43.75
56.25
%
GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay
tGTKHDX
0.5
5.0
ns
GTX_CLK clock rise time (20%–80%)
tGTXR
——
1.0
ns
GTX_CLK clock fall time (80%–20%)
tGTXF
——
1.0
ns
Notes:
1. The symbols for timing specifications follow the pattern t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and
t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII transmit timing (GT)
with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) reaching the
valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with respect to the tGTX clock
reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X) or hold time. In general,
the clock reference symbol is based on three letters representing the clock of a particular function. For example, the subscript
of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate
letter: R (rise) or F (fall).
Table 26. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
RX_CLK clock period
tGRX
—8.0
ns
RX_CLK duty cycle
tGRXH/tGRX
40
60
%
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
ns
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.5
ns
GTX_CLK
TXD[7:0]
tGTKHDX
tGTX
tGTXH
tGTXR
tGTXF
TX_EN
TX_ER
相关PDF资料
PDF描述
IDT71V67703S80BG8 IC SRAM 9MBIT 80NS 119BGA
MPC8250ACZUMHBC IC MPU POWERQUICC II 480-TBGA
IDT71V67703S75BG8 IC SRAM 9MBIT 75NS 119BGA
IDT71V67603S150BGG8 IC SRAM 9MBIT 150MHZ 119BGA
MPC8250AZUPIBC IC MPU POWERQUICC II 480-TBGA
相关代理商/技术参数
参数描述
MPC8349EZUAGD 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC83xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA,FCBGA 供应商设备封装:783-FCPBGA(29x29) 包装:托盘
MPC8349EZUAGDB 功能描述:微处理器 - MPU 8349 TBGA PB W/ ENCRYP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8349EZUAGFB 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications
MPC8349EZUAJD 功能描述:IC MPU PWRQUICC II PRO 672-TBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC83xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA,FCBGA 供应商设备封装:783-FCPBGA(29x29) 包装:托盘
MPC8349EZUAJDB 功能描述:微处理器 - MPU 8349 TBGA PB W/ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324