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型号： MPC8360CVVAGDGA
厂商： Freescale Semiconductor
文件页数： 22/102页
文件大小： 0K
描述： IC MPU POWERQUICC II PRO 740TBGA
标准包装： 21
系列： MPC83xx
处理器类型： 32-位 MPC83xx PowerQUICC II Pro
速度： 400MHz
电压： 1.2V
安装类型： 表面贴装
封装/外壳： 740-LBGA
供应商设备封装： 740-TBGA（37.5x37.5）
包装： 托盘
配用： MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
26
Freescale Semiconductor
GMII, MII, RMII, TBI, RGMII, and RTBI AC Timing Specifications
Physical Layer Device Specification Version 1.2a (9/22/2000). The electrical characteristics for the MDIO and MDC are
specified in Section 8.3, “Ethernet Management Interface Electrical Characteristics.”
8.1.1
10/100/1000 Ethernet DC Electrical Characteristics
The electrical characteristics specified here apply to media independent interface (MII), reduced gigabit media independent
interface (RGMII), reduced ten-bit interface (RTBI), reduced media independent interface (RMII) signals, management data
input/output (MDIO) and management data clock (MDC).
The MII and RMII interfaces are defined for 3.3 V, while the RGMII and RTBI interfaces can be operated at 2.5 V. The RGMII
and RTBI interfaces follow the Reduced Gigabit Media-Independent Interface (RGMII) Specification Version 1.3. The RMII
interface follows the RMII Consortium RMII Specification Version 1.2.
8.2
GMII, MII, RMII, TBI, RGMII, and RTBI AC Timing Specifications
The AC timing specifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.
8.2.1
GMII Timing Specifications
This sections describe the GMII transmit and receive AC timing specifications.
Table 25. RGMII/RTBI, GMII, TBI, MII, and RMII DC Electrical Characteristics (when operating at 3.3 V)
Parameter
Symbol
Conditions
Min
Max
Unit
Notes
Supply voltage 3.3 V
LVDD
—
2.97
3.63
V
1
Output high voltage
VOH
IOH = –4.0 mA
LVDD = Min
2.40
LVDD + 0.3
V
—
Output low voltage
VOL
IOL = 4.0 mA
LVDD = Min
GND
0.50
V
—
Input high voltage
VIH
——
2.0
LVDD + 0.3
V
—
Input low voltage
VIL
—
–0.3
0.90
V
—
Input current
IIN
0 V
≤VIN ≤LVDD
—±10
μA—
Note:
1. GMII/MII pins that are not needed for RGMII, RMII, or RTBI operation are powered by the OVDD supply.
Table 26. RGMII/RTBI DC Electrical Characteristics (when operating at 2.5 V)
Parameters
Symbol
Conditions
Min
Max
Unit
Supply voltage 2.5 V
LVDD
—
2.37
2.63
V
Output high voltage
VOH
IOH = –1.0 mA
LVDD = Min
2.00
LVDD + 0.3
V
Output low voltage
VOL
IOL = 1.0 mA
LVDD = Min
GND – 0.3
0.40
V
Input high voltage
VIH
—LVDD = Min
1.7
LVDD + 0.3
V
Input low voltage
VIL
—LVDD = Min
–0.3
0.70
V
Input current
IIN
0 V
≤VIN ≤LVDD
—±10
μA
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相关代理商/技术参数
参数描述
MPC8360CVVAGDHA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360CVVAGFGA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360CVVAGFHA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360CVVAJDG 功能描述:微处理器 - MPU 8360 TBGA NON-ENC NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8360CVVAJDGA 功能描述:微处理器 - MPU 8360 TBGA C NONENC NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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