- 您现在的位置：买卖IC网 > PDF目录17123 > MPC8360EA-MDS-PB (Freescale Semiconductor)KIT APPLICATION DEV 8360 SYSTEM PDF资料下载
参数资料
| 型号： | MPC8360EA-MDS-PB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 1/102页 |
| 文件大小： | 0K |
| 描述： | KIT APPLICATION DEV 8360 SYSTEM |
| 标准包装： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 类型： | MPU |
| 适用于相关产品： | MPC8360EA |
| 所含物品： | 板 |
| 相关产品： | MPC8360ZUALFHA-ND - IC MPU POWERQUICC II PRO 740TBGA MPC8360ZUAJDGA-ND - IC MPU POWERQUICC II PRO 740TBGA MPC8360ZUAGDGA-ND - IC MPU POWERQUICC II PRO 740TBGA MPC8360VVALFHA-ND - IC MPU POWERQUICC II PRO 740TBGA MPC8360VVAJDGA-ND - IC MPU POWERQUICC II PRO 740TBGA MPC8360VVAGDGA-ND - IC MPU POWERQUICC II PRO 740TBGA MPC8360EZUALFHA-ND - IC MPU POWERQUICC II PRO 740TBGA MPC8360EZUAJDGA-ND - IC MPU POWERQUICC II PRO 740TBGA MPC8360EZUAGDGA-ND - IC MPU POWERQUICC II PRO 740TBGA MPC8360EVVALFHA-ND - IC MPU POWERQUICC II PRO 740TBGA 更多... |
当前第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页
2011 Freescale Semiconductor, Inc. All rights reserved.
Freescale Semiconductor
Technical Data
This document provides an overview of the MPC8360E/58E
PowerQUICC II Pro processor revision 2.x TBGA features, including a
block diagram showing the major functional components. This device is
a cost-effective, highly integrated communications processor that
addresses the needs of the networking, wireless infrastructure, and
telecommunications markets. Target applications include next generation
DSLAMs, network interface cards for 3G base stations (Node Bs),
routers, media gateways, and high end IADs. The device extends current
PowerQUICC II Pro offerings, adding higher CPU performance,
additional functionality, faster interfaces, and robust interworking
between protocols while addressing the requirements related to
time-to-market, price, power, and package size. This device can be used
for the control plane and also has data plane functionality.
For functional characteristics of the processor, refer to the MPC8360E
PowerQUICC II Pro Integrated Communications Processor Reference
Manual, Rev. 3.
To locate any updates for this document, refer to the MPC8360E product
summary page on our website listed on the back cover of this document
or contact your Freescale sales office.
1
Overview
This section describes a high-level overview including features and
general operation of the MPC8360E/58E PowerQUICC II Pro processor.
A major component of this device is the e300 core, which includes
32 Kbytes of instruction and data cache and is fully compatible with the
Power Architecture 603e instruction set. The new QUICC Engine
module provides termination, interworking, and switching between a
Document Number: MPC8360EEC
Rev. 5, 09/2011
Contents
MPC8360E/MPC8358E
PowerQUICC II Pro Processor
Revision 2.x TBGA Silicon
Hardware Specifications
相关PDF资料 |
PDF描述 |
|---|---|
| AG001-01 | KIT ENGINEERING EVALUATION |
| D-SCE-1K-6.4-50-9 | HEAT SHRINK SLEEVE MARKER |
| AIRD-02-271K | INDUCTOR PWR DRUM CORE 270UH |
| SPX1431M1-L/TR | IC VREF SHUNT PREC ADJ SOT-89-3 |
| DS2790E+ | IC FUEL GAUGE BATT 28TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8360ECVVADDH | 功能描述:微处理器 - MPU 8360 TBGA ENCRP NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8360ECVVAGDG | 功能描述:微处理器 - MPU 8360 TBGA ENCRP NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8360ECVVAGDGA | 功能描述:微处理器 - MPU 8360 TBGA C ENC NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8360ECVVAGDHA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECVVAGFGA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
发布紧急采购，3分钟左右您将得到回复。