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参数资料
| 型号： | MPC8360ECZUAJFHA |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740 |
| 封装： | 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740 |
| 文件页数： | 8/102页 |
| 文件大小： | 606K |
| 代理商： | MPC8360ECZUAJFHA |
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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
13
Power Sequencing
667
333
500
6.1
6.8
W
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 6.
2. Typical power is based on a voltage of VDD = 1.2 V or 1.3 V, a junction temperature of TJ = 105° C, and a Dhrystone
benchmark application.
3. Thermal solutions need to design to a value higher than typical power on the end application, TA target, and I/O power.
4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105° C, and an artificial smoke test.
5. Maximum power is based on a voltage of VDD = 1.3 V for applications that use 667 MHz (CPU)/500 (QE) with WC process,
a junction TJ = 105° C, and an artificial smoke test.
6. Typical power is based on a voltage of VDD = 1.3 V, a junction temperature of TJ = 70° C, and a Dhrystone benchmark
application.
7. Maximum power is based on a voltage of VDD = 1.3 V for applications that use 667 MHz (CPU) or 500 (QE) with WC
process, a junction TJ = 70° C, and an artificial smoke test.
8. This frequency combination is only available for rev. 2.0 silicon.
9. This frequency combination is not available for rev. 2.0 silicon.
Table 5. MPC8358E TBGA Core Power Dissipation1
Core
Frequency (MHz)
CSB
Frequency (MHz)
QUICC Engine
Frequency (MHz)
Typical
Maximum
Unit
Notes
266
300
4.1
4.5
W
400
266
400
4.5
5.0
W
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 6.
2. Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105° C, and a Dhrystone benchmark
application.
3. Thermal solutions need to design to a value higher than typical power on the end application, TA target, and I/O power.
4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105° C, and an artificial smoke test.
Table 4. MPC8360E TBGA Core Power Dissipation1 (continued)
Core
Frequency (MHz)
CSB
Frequency (MHz)
QUICC Engine
Frequency (MHz)
Typical
Maximum
Unit
Notes
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8360ECZUALDGA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECZUALDHA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECZUALFGA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360ECZUALFHA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360E-MDS-PBE | 功能描述:开发板和工具包 - 其他处理器 SYSTEM BOARD FOR THE FRE RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
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