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参数资料
| 型号： | MPC8360EZUAGFHA |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 400 MHz, RISC PROCESSOR, PBGA740 |
| 封装： | 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740 |
| 文件页数： | 8/102页 |
| 文件大小： | 606K |
| 代理商： | MPC8360EZUAGFHA |
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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
13
Power Sequencing
667
333
500
6.1
6.8
W
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 6.
2. Typical power is based on a voltage of VDD = 1.2 V or 1.3 V, a junction temperature of TJ = 105° C, and a Dhrystone
benchmark application.
3. Thermal solutions need to design to a value higher than typical power on the end application, TA target, and I/O power.
4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105° C, and an artificial smoke test.
5. Maximum power is based on a voltage of VDD = 1.3 V for applications that use 667 MHz (CPU)/500 (QE) with WC process,
a junction TJ = 105° C, and an artificial smoke test.
6. Typical power is based on a voltage of VDD = 1.3 V, a junction temperature of TJ = 70° C, and a Dhrystone benchmark
application.
7. Maximum power is based on a voltage of VDD = 1.3 V for applications that use 667 MHz (CPU) or 500 (QE) with WC
process, a junction TJ = 70° C, and an artificial smoke test.
8. This frequency combination is only available for rev. 2.0 silicon.
9. This frequency combination is not available for rev. 2.0 silicon.
Table 5. MPC8358E TBGA Core Power Dissipation1
Core
Frequency (MHz)
CSB
Frequency (MHz)
QUICC Engine
Frequency (MHz)
Typical
Maximum
Unit
Notes
266
300
4.1
4.5
W
400
266
400
4.5
5.0
W
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 6.
2. Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105° C, and a Dhrystone benchmark
application.
3. Thermal solutions need to design to a value higher than typical power on the end application, TA target, and I/O power.
4. Maximum power is based on a voltage of VDD = 1.2 V, WC process, a junction TJ = 105° C, and an artificial smoke test.
Table 4. MPC8360E TBGA Core Power Dissipation1 (continued)
Core
Frequency (MHz)
CSB
Frequency (MHz)
QUICC Engine
Frequency (MHz)
Typical
Maximum
Unit
Notes
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8360EZUAHFH | 功能描述:微处理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8360EZUAJDG | 功能描述:微处理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8360EZUAJDGA | 功能描述:微处理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8360EZUAJDHA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8360EZUAJFGA | 制造商:Freescale Semiconductor 功能描述:MPC83XX RISC 32-BIT 0.13UM 533MHZ 1.8V/2.5V/3.3V 740-PIN TBG - Trays |
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