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型号： MPC8360VVALFHA
厂商： Freescale Semiconductor
文件页数： 4/102页
文件大小： 0K
描述： IC MPU POWERQUICC II PRO 740TBGA
标准包装： 21
系列： MPC83xx
处理器类型： 32-位 MPC83xx PowerQUICC II Pro
速度： 667MHz
电压： 1.3V
安装类型： 表面贴装
封装/外壳： 740-LBGA
供应商设备封装： 740-TBGA（37.5x37.5）
包装： 托盘
配用： MPC8360EA-MDS-PB-ND - KIT APPLICATION DEV 8360 SYSTEM
MPC8360E-RDK-ND - BOARD REFERENCE DESIGN FOR MPC
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
101
Part Numbers Fully Addressed by this Document
3
03/2010
Changed references to RCWH[PCICKEN] to RCWH[PCICKDRV].
In Table 2, added extended temperature characteristics.
Added Figure 6, “DDR Input Timing Diagram.”
In Figure 53, “Mechanical Dimensions and Bottom Surface Nomenclature of the TBGA Package,”
removed watermark.
Updated the title of Table 19,”DDR SDRAM Input AC Timing Specifications.”
In Table 20, “DDR and DDR2 SDRAM Input AC Timing Specifications Mode,” changed table subtitle.
In Table 27–Table 30, and Table 33—Table 34, changed the rise and fall time specifications to reference
20–80% and 80–20% of the voltage supply, respectively.
In Table 38, “IEEE 1588 Timer AC Specifications,” changed first parameter to “Timer clock frequency.”
In Table 45, “I2C AC Electrical Specifications,” changed units to “ns” for tI2DVKH.
In Table 66, “MPC8360E TBGA Pinout Listing,” and Table 67 “MPC8358E TBGA Pinout Listing, added
note 7: “This pin must always be tied to GND” to the TEST pin and added a note to SPARE1 stating: “This
pin must always be left not connected.”
In Section 4, “Clock Input Timing,” added note regarding rise/fall time on QUICC Engine block input pins.
Added Section 4.3, “Gigabit Reference Clock Input Timing.”
Updated Section 8.1.1, “10/100/1000 Ethernet DC Electrical Characteristics.”
In Section 20.3, “Pinout Listings,” added sentence stating “Refer to AN3097, ‘MPC8360/MPC8358E
PowerQUICC Design Checklist,’ for proper pin termination and usage.”
In Section 21, “Clocking,” removed statement: “The OCCR[PCICDn] parameters select whether CLKIN
or CLKIN/2 is driven out on the PCI_CLK_OUTn signals.”
In Section 21.1, “System PLL Configuration,” updated the system VCO frequency conditions.
In Table 80, added extended temperature characteristics.
2
12/2007 Initial release.
Table 82. Revision History (continued)
Rev.
Number
Date
Substantive Change(s)
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MPC8360ZUADDH 功能描述:微处理器 - MPU 8360 TBGA NON-ENCRP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8360ZUAGDG 功能描述:微处理器 - MPU 8360 TBGA NON-ENCRP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8360ZUAGDGA 功能描述:微处理器 - MPU 8360 TBGA NON-ENCRP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8360ZUAGDHA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ZUAGFGA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
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