参数资料
型号: MPC8360ZUAJDGA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 533 MHz, RISC PROCESSOR, PBGA740
封装: 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740
文件页数: 63/102页
文件大小: 606K
代理商: MPC8360ZUAJDGA
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 5
Freescale Semiconductor
63
Package Parameters for the TBGA Package
20
Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8360E/58E is available in a tape ball grid
the TBGA Package,for information on the package.
20.1
Package Parameters for the TBGA Package
The package parameters for rev. 2.0 silicon are as provided in the following list. The package type is 37.5 mm
× 37.5 mm, 740
tape ball grid array (TBGA).
Package outline
37.5 mm
× 37.5 mm
Interconnects
740
Pitch
1.00 mm
Module height (typical)
1.46 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
Ball diameter (typical)
0.64 mm
相关PDF资料
PDF描述
MPC8360ZUALDHA 32-BIT, 667 MHz, RISC PROCESSOR, PBGA740
MPC8377ECVRANGA 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689
MPC8377EVRALGA 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689
MPC8377EVRANGA 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689
MPC8378ECVRALGA 32-BIT, 400 MHz, MICROPROCESSOR, PBGA689
相关代理商/技术参数
参数描述
MPC8360ZUAJDHA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ZUAJFGA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ZUAJFHA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ZUALDGA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
MPC8360ZUALDHA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications