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| 型号： | MPC852TVR66A |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 5/80页 |
| 文件大小： | 0K |
| 描述： | IC MPU POWERQUICC 66MHZ 256PBGA |
| 标准包装： | 60 |
| 系列： | MPC8xx |
| 处理器类型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 66MHz |
| 电压： | 1.8V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 256-BGA |
| 供应商设备封装： | 256-PBGA（23x23） |
| 包装： | 托盘 |
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MPC852T PowerQUICC Hardware Specifications, Rev. 4
Freescale Semiconductor
13
Layout Practices
The MBMR[GPLB4DIS], PAPAR, PADIR, PBPAR, PBDIR, PCPAR, and PCDIR should be configured
with the mandatory value in Table 6 in the boot code after the reset deasserts.
11 Layout Practices
Each VDD pin on the MPC852T should be provided with a low-impedance path to the board’s supply. Each
GND pin should likewise be provided with a low-impedance path to ground. The power supply pins drive
distinct groups of logic on chip. The V
DD power supply should be bypassed to ground using at least four
0.1 F bypass capacitors located as close as possible to the four sides of the package. Each board designed
should be characterized and additional appropriate decoupling capacitors should be used if required. The
capacitor leads and associated printed-circuit traces connecting to chip VDD and GND should be kept to
less than half an inch per capacitor lead. At a minimum, a four-layer board employing two inner layers as
VDD and GND planes should be used.
All output pins on the MPC852T have fast rise and fall times. Printed-circuit (PC) trace interconnection
length should be minimized to minimize undershoot and reflections that these fast output switching times
cause. This recommendation particularly applies to the address and data buses. Maximum PC trace lengths
of six inches are recommended. Capacitance calculations should consider all device loads as well as
parasitic capacitances that the PC traces cause. Attention to proper PCB layout and bypassing becomes
especially critical in systems with higher capacitive loads, because these loads create higher transient
currents in the VDD and GND circuits. Pull up all unused inputs or signals that are inputs during reset.
Special care should be taken to minimize the noise levels on the PLL supply pins. For more information,
please refer to the MPC866 PowerQUICC Family Reference Manual, Section 14.4.3, “Clock
Synthesizer Power (VDDSYN, VSSSYN, VSSSYN1).”
Table 6. Mandatory Reset Configuration of MPC852T
Register/Configuration
Field
Value
(Binary)
HRCW (Hardware reset configuration word)
HRCW[DBGC]
X1
SIUMCR (SIU module configuration register)
SIUMCR[DBGC]
X1
MBMR (Machine B mode register)
MBMR[GPLB4DIS}
0
PAPAR (Port A pin assignment register)
PAPAR[4–7]
PAPAR[12–15]
0
PADIR (Port A data direction register)
PADIR[4–7]
PADIR[12–15]
1
PBPAR (Port B pin assignment register)
PBPAR[14]
PBPAR[16–23]
PBPAR[26–27]
0
PBDIR (Port B data direction register)
PBDIR[14]
PBDIR[16–23]
PBDIR[26–27]
1
PCPAR (Port C pin assignment register)
PCPAR[8–11]
PCDIR[14]
0
PCDIR (Port C data direction register)
PCDIR[8–11]
PCDIR[14]
1
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC852TVR66A | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 66MHZ BGA-256 |
| MPC852TVR80A | 功能描述:微处理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC852TZT100A | 功能描述:微处理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC852TZT50A | 功能描述:微处理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC852TZT66A | 功能描述:微处理器 - MPU POWER QUICC II HIP6W RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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