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参数资料
型号： MPC8533EVTANG
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 800 MHz, MICROPROCESSOR, PBGA783
封装： 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FC-PBGA-783
文件页数： 115/116页
文件大小： 1273K
代理商： MPC8533EVTANG
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
98
Freescale Semiconductor
Thermal
Figure 58 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 58. Package with Heat Sink Mounted to a Printed-Circuit Board
The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is
conducted through the silicon and through the heat sink attach material (or thermal interface material), and
finally to the heat sink. The junction-to-case thermal resistance is low enough that the heat sink attach
material and heat sink thermal resistance are the dominant terms.
20.3.2
Thermal Interface Materials
A thermal interface material is required at the package-to-heat sink interface to minimize the thermal
contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 59 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance. The bare joint results in a
thermal resistance approximately six times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 57). Therefore, the synthetic grease offers the best thermal performance, especially at the low
interface pressure.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
相关PDF资料
PDF描述
MPC8533EVTARJ 32-BIT, 1067 MHz, MICROPROCESSOR, PBGA783
MPC8560PXAPFB 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
MPC8560PXAPDB 32-BIT, 833 MHz, RISC PROCESSOR, PBGA783
MPC8560PXALDB 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
MPC8560CPXALFB 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
相关代理商/技术参数
参数描述
MPC8533EVTANGA 功能描述:微处理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8533EVTAQG 功能描述:微处理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8533EVTAQGA 功能描述:微处理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8533EVTARJ 功能描述:微处理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8533EVTARJA 功能描述:微处理器 - MPU PQ38K 8533E RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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