参数资料
型号: MPC8535ECVTANGA
厂商: Freescale Semiconductor
文件页数: 18/126页
文件大小: 0K
描述: MPU POWERQUICC III 783FCPBGA
标准包装: 1
系列: MPC85xx
处理器类型: 32-位 MPC85xx PowerQUICC III
速度: 800MHz
电压: 1V
安装类型: 表面贴装
封装/外壳: 783-BBGA,FCBGA
供应商设备封装: 783-FCPBGA(29x29)
包装: 托盘
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Hardware Design Considerations
Freescale Semiconductor
114
This figure shows the PLL power supply filter circuit.
Figure 75. Chip PLL Power Supply Filter Circuit
The AVDD_SRDSn signals provides power for the analog portions of the SerDes PLL. To ensure stability of the internal clock,
the power supplied to the PLL is filtered using a circuit similar to the one shown in following Figure 76. For maximum
effectiveness, the filter circuit is placed as closely as possible to the AVDD_SRDSn balls to ensure it filters out as much noise
as possible. The ground connection should be near the AVDD_SRDSn balls. The 0.003-F capacitor is closest to the balls,
followed by the 1-F capacitor, and finally the 1 ohm resistor to the board supply plane. The capacitors are connected from
AVDD_SRDSn to the ground plane. Use ceramic chip capacitors with the highest possible self-resonant frequency. All traces
should be kept short, wide and direct.
Figure 76. SerDes PLL Power Supply Filter Circuit
Note the following:
AVDD should be a filtered version of SVDD.
Signals on the SerDes interface are fed from the XVDD power plane.
3.3
Pin States in Deep Sleep State
In all low power mode by default, all input and output pads remain driven as per normal functional operation. The inputs remain
enabled.
The exception is that in Deep Sleep mode, GCR[DEEPSLEEP_Z] can be used to tristate a subset of output pads, and disable
the receivers of input pads as defined in Table 1. See the MPC8536E PowerQUICC III Integrated Processor Reference Manual
for details.
3.4
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, this chip can generate transient power surges and high
frequency noise in its power supply, especially while driving large capacitive loads. This noise must be prevented from reaching
other components in the chip system, and the chip itself requires a clean, tightly regulated source of power. Therefore, it is
recommended that the system designer place at least one decoupling capacitor at each VDD, TVDD, BVDD, OVDD, GVDD, and
LVDD pin of the chip. These decoupling capacitors should receive their power from separate VDD,TVDD, BVDD, OVDD, GVDD,
and LVDD, and GND power planes in the PCB, utilizing short low impedance traces to minimize inductance. Capacitors must
be placed directly under the chip using a standard escape pattern as much as possible. If some caps are to be placed surrounding
the part it should be routed with short and large trace to minimize the inductance.
VDD
AVDD
2.2 F
GND
Low ESL Surface Mount Capacitors
10
Ω
2.2 F 1
0.003 F
GND
1.0
Ω
AVDD - SRDS
1. An 0805 sized capacitor is recommended for system initial bring-up
SnVDD
2.2 F 1
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