参数资料
型号: MPC8536EAVTANGA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 800 MHz, MICROPROCESSOR, PBGA783
封装: 29 X 29 MM, 2.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783
文件页数: 17/127页
文件大小: 1893K
代理商: MPC8536EAVTANGA
Thermal
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
113
The recommended attachment method to the heat sink is illustrated in Figure 73. The heat sink should be attached to the
printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45
Newton).
Figure 73. Package Exploded Cross-Sectional View with Several Heat Sink Options
The system board designer can choose between several types of heat sinks to place on the device. Ultimately, the final selection
of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass,
attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha
Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances, that will allow the MPC8536E to function in various environments.
2.24.3.1
Internal Package Conduction Resistance
For the packaging technology, shown in Table 70, the intrinsic internal conduction thermal resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Figure 74 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board.
Figure 74. Package with Heat Sink Mounted to a Printed-Circuit Board
Thermal Interface Material
Heat Sink
FC-PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Die
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Solder Spheres
Die Junction
Die/Package
(Note the internal versus external package resistance)
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相关代理商/技术参数
参数描述
MPC8536EAVTAQG 功能描述:微处理器 - MPU PQ38S 8536 SQUID RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8536EAVTAQGA 功能描述:微处理器 - MPU 8536 Encrypted RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8536EAVTATGA 功能描述:微处理器 - MPU 8536 Encrypted RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8536EAVTATH 功能描述:微处理器 - MPU PQ38S 8536 SQUID RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8536EAVTATHA 功能描述:微处理器 - MPU 8536 Encrypted RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324