参数资料
型号: MPC8536EBVTAKGA
厂商: Freescale Semiconductor
文件页数: 48/126页
文件大小: 0K
描述: MPU PWRQUICC III 600MHZ 783PBGA
产品培训模块: MPC8536E QUICC III Processor
标准包装: 1
系列: MPC85xx
处理器类型: 32-位 MPC85xx PowerQUICC III
速度: 600MHz
电压: 1V
安装类型: 表面贴装
封装/外壳: 783-BBGA,FCBGA
供应商设备封装: 783-FCPBGA(29x29)
包装: 托盘
其它名称: MPC8536EBVTAKG
MPC8536EBVTAKG-ND
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Electrical Characteristics
Freescale Semiconductor
28
See Section 2.23.6.1, “SYSCLK to Platform Frequency Options,” for the full range of CCB frequencies that the chip supports.
Maximum (A)
1500
500
667
1.0
1.1
105
/ 90
7.1/6.1
5.0/4.0
1, 3, 8
Thermal (W)
5.9/4.9
5.0/4.0
1, 4, 8
Typical (W)
65
3.0
1.7
1, 2
Doze (W)
2.2
3.3
1.5
2.1
1
Nap (W)
1.1
2.1
1.5
2.1
1
Sleep (W)
1.1
2.1
1.1
1.7
1
Deep Sleep
(W)
35
0
0.6
1.2
1, 6
Notes:
1. These values specify the power consumption at nominal voltage and apply to all valid processor bus frequencies and
configurations. The values do not include power dissipation for I/O supplies.
2. Typical power is an average value measured at the nominal recommended core voltage (VDD) and 65°C junction temperature
(see Table 3) while running the Dhrystone benchmark.
3. Maximum power is the maximum power measured with the worst process and recommended core and platform voltage (VDD)
at maximum operating junction temperature (see Table 3) while running a smoke test which includes an entirely
L1-cache-resident, contrived sequence of instructions which keep the execution unit maximally busy.
4. Thermal power is the maximum power measured with worst case process and recommended core and platform voltage (VDD)
at maximum operating junction temperature (see Table 3) while running the Dhrystone benchmark.
5. VDD Core = 1.0 V for 600 to 1333 MHz, 1.1 V for 1500 MHz.
6. Maximum power is the maximum number measured with USB1, eTSEC1, and DDR blocks enabled. The Mean power is the
mean power measured with only external interrupts enabled and DDR in self refresh.
7. Mean power is provided for information purposes only and is the mean power consumed by a statistically significant range of
devices.
8. Maximum operating junction temperature (see Table 3) for Commercial Tier is 90 0C, for Industrial Tier is 105 0C.
9. Platform power is the power supplied to all the
VDD_PLAT pins.
Table 5. Power Dissipation (continued)5
Power Mode
Core
Frequen
cy
CCB
Frequen
cy
DDR
Frequen
cy
VDD
Platfor
m
VDD
Core 5
Junction
Tempera
ture
Core Power
Platform Power9
Notes
(MHz)
(V)
(
°C)
mean7
Max
mean7
Max
相关PDF资料
PDF描述
MPC8536EAVTAUL MPU PWRQUICC III 1333MHZ 783PBGA
396-020-520-204 CARD EDGE 20POS DL .125X.250 BLK
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MPC8536EBVTANG 功能描述:微处理器 - MPU 32-BIT 800MHz RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8536EBVTANGA 功能描述:微处理器 - MPU 8536 Encrypted RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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MPC8536EBVTAQGA 功能描述:微处理器 - MPU 8536 Encrypted RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8536EBVTATH 功能描述:微处理器 - MPU 32-BIT 1.25GHz RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324