参数资料
型号: MPC8540PXAQFC
厂商: Freescale Semiconductor
文件页数: 31/104页
文件大小: 0K
描述: MPU POWERQUICC III 783FCPBGA
标准包装: 36
系列: MPC85xx
处理器类型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
电压: 1.3V
安装类型: 表面贴装
封装/外壳: 784-BBGA,FCBGA
供应商设备封装: 783-FCPBGA(29x29)
包装: 托盘
MPC8540 Integrated Processor Hardware Specifications, Rev. 4.1
32
Freescale Semiconductor
Ethernet: Three-Speed,10/100, MII Management
8.3.2 MII AC Electrical Specifications
This section describes the MII transmit and receive AC specifications.
8.3.2.1
MII Transmit AC Timing Specifications
Table 31 provides the MII transmit AC timing specifications.
Table 30. MII DC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
Supply voltage 3.3 V
OVDD
3.13
3.47
V
Output high voltage
(OVDD = Min, IOH = –4.0 mA)
VOH
2.40
OVDD + 0.3
V
Output low voltage
(OVDD = Min, IOL = 4.0 mA)
VOL
GND
0.50
V
Input high voltage
VIH
1.70
V
Input low voltage
VIL
–0.3
0.90
V
Input high current
(VIN= OVDD
1)
IIH
—40
μA
Input low current
(VIN= GND
1)
IIL
–600
μA
Note:
1.Note that the symbol VIN, in this case, represents the OVIN symbol referenced in Table 1 and Table 2.
Table 31. MII Transmit AC Timing Specifications
At recommended operating conditions with OVDD of 3.3 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
TX_CLK clock period 10 Mbps
tMTX
—400
ns
TX_CLK clock period 100 Mbps
tMTX
—40—
ns
TX_CLK duty cycle
tMTXH/tMTX
35
65
%
TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay
tMTKHDX
1
5
15
ns
TX_CLK data clock rise and fall time
tMTXR, tMTXF
2,3
1.0
4.0
ns
Note:
1.The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tMTKHDX symbolizes MII transmit timing (MT) from the time tMTX clock reference (K) going high (H) until data outputs
(D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters
representing the clock of a particular functional. For example, the subscript of tMTX represents the MII (M) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2.Signal timings are measured at 0.7 V and 1.9 V voltage levels.
3.Guaranteed by design.
相关PDF资料
PDF描述
AMM44DRAI CONN EDGECARD 88POS .156 R/A
XF2J-2624-11A CONN FPC 26POS 0.5MM PITCH SMD
IDT709269L12PFI8 IC SRAM 256KBIT 12NS 100TQFP
ABB100DHBT CONN EDGECARD 200PS R/A .050 SLD
XF2M-5515-1AH CONN FPC 55POS 0.5MM DBL SMD
相关代理商/技术参数
参数描述
MPC8540VT533JB 功能描述:微处理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8540VT667LB 功能描述:微处理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8540VT667LC 功能描述:微处理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8540VT833LB 功能描述:微处理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8540VT833LC 功能描述:微处理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324