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参数资料
型号： MPC8545EVUAQGB
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 1000 MHz, MICROPROCESSOR, CBGA783
封装： 29 X 29 MM, 1 MM PITCH, FLIP CHIP, LEAD FREE, CERAMIC, BGA-783
文件页数： 48/142页
文件大小： 1504K
代理商： MPC8545EVUAQGB
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
141
Document Revision History
1
10/2007
Adjusted maximum SYSCLK frequency down in Table 5, “SYSCLK AC Timing Specifications” per
device erratum GEN-13.
Clarified notes to Table 6, “EC_GTX_CLK125 AC Timing Specifications.”
Added Section 4.4, “PCI/PCI-X Reference Clock Timing.”
Clarified descriptions and added PCI/PCI-X to Table 9, “PLL Lock Times.”
Removed support for 266 and 200 Mbps data rates per device erratum GEN-13 in Section 6, “DDR and
DDR2 SDRAM.”
Clarified Note 4 of Table 19, “DDR SDRAM Output AC Timing Specifications.”
Clarified the reference clock used in Section 7.2, “DUART AC Electrical Specifications.”
Corrected VIH(min) in Table 22, “GMII, MII, RMII, and TBI DC Electrical Characteristics.”
Corrected VIL(max) in Table 23, “GMII, MII, RMII, TBI, RGMII, RTBI, and FIFO DC Electrical
Characteristics.”
Removed DC parameters from Table 24, Table 25, Table 26, Table 27, Table 28, Table 29, Table 32,
Table 34, and Table 35.
Corrected VIH(min) in Table 36, “MII Management DC Electrical Characteristics.”
Corrected tMDC(min) in Table 37, “MII Management AC Timing Specifications.”
Updated parameter descriptions for tLBIVKH1, tLBIVKH2, tLBIXKH1, and tLBIXKH2 in Table 40, “Local Bus
Timing Parameters (BVDD = 3.3 V)—PLL Enabled” and Table 40, “Local Bus Timing Parameters
(BVDD = 2.5 V)—PLL Enabled.”
Updated parameter descriptions for tLBIVKH1, tLBIVKL2, tLBIXKH1, and tLBIXKL2 in Table 42, “Local Bus
Timing Parameters—PLL Bypassed.” Note that tLBIVKL2 and tLBIXKL2 were previously labeled tLBIVKH2
and tLBIXKH2.
Added LUPWAIT signal to Figure 23, “Local Bus Signals (PLL Enabled)” and Figure 24, “Local Bus
Signals (PLL Bypass Mode).”
Added LGTA signal to Figure 25, Figure 26, Figure 27 and Figure 28.
Corrected LUPWAIT assertion in Figure 26 and Figure 28.
Clarified the PCI reference clock in Section 14.2, “PCI/PCI-X AC Electrical Specifications”
Added Section 17.1, “Package Parameters.”
Added PBGA thermal information in Section 20.2, “Thermal for Version 2.1.1 and 2.1.2 Silicon
FC-PBGA with Full Lid.”
Updated.”
Updated Table 83, “Part Numbering Nomenclature.”
0
07/2007
Initial Release
Table 84. Document Revision History (continued)
Revision
Date
Substantive Change(s)
相关PDF资料
PDF描述
MPC8547CVUATGB 32-BIT, 1200 MHz, MICROPROCESSOR, CBGA783
MPC8547HXAQGA 32-BIT, 1000 MHz, MICROPROCESSOR, CBGA783
MPC8548CPXAQG 32-BIT, 1000 MHz, MICROPROCESSOR, PBGA783
MPC8548CVTAVH 32-BIT, 1500 MHz, MICROPROCESSOR, PBGA783
MPC8548CVUAUHA 32-BIT, 1333 MHz, MICROPROCESSOR, CBGA783
相关代理商/技术参数
参数描述
MPC8545EVUATG 功能描述:微处理器 - MPU PQ38 8548E PB-FREE RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8545HXANG 功能描述:微处理器 - MPU PQ38 8548 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8545HXAQG 功能描述:微处理器 - MPU PQ38 8548 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8545HXATG 功能描述:微处理器 - MPU PQ38 8548 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8545PXANGA 功能描述:微处理器 - MPU PQ3 8545 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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