参数资料
型号: MPC8568ECVTANGGA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 800 MHz, RISC PROCESSOR, PBGA1023
封装: 33 X 33 MM, 2.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1023
文件页数: 38/139页
文件大小: 1449K
代理商: MPC8568ECVTANGGA
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
132
Freescale Semiconductor
System Design Information
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, TVDD, BVDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the
smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating
to ensure the quick response time necessary. They should also be connected to the power and ground
planes through two vias to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS
tantalum or Sanyo OSCON).
25.4
SerDes Block Power Supply Decoupling Recommendations
The SerDes block requires a clean, tightly regulated source of power (SCOREVDD and XVDD) to ensure
low jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is
outlined below.
Only surface mount technology (SMT) capacitors should be used to minimize inductance. Connections
from all capacitors to power and ground should be done with multiple vias to further reduce inductance.
First, the board should have at least 10 x 10-nF SMT ceramic chip capacitors as close as possible
to the supply balls of the device. Where the board has blind vias, these capacitors should be placed
directly below the chip supply and ground connections. Where the board does not have blind vias,
these capacitors should be placed in a ring around the device as close to the supply and ground
connections as possible.
Second, there should be a 1-F ceramic chip capacitor on each side of the device. This should be
done for all SerDes supplies.
Third, between the device and any SerDes voltage regulator there should be a 10-F, low
equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-F, low ESR SMT
tantalum chip capacitor. This should be done for all SerDes supplies.
25.5
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. All unused active low inputs should be tied to VDD, TVDD, BVDD, OVDD, GVDD and LVDD as
required. All unused active high inputs should be connected to GND. All NC (no-connect) signals must
remain unconnected. Power and ground connections must be made to all external VDD, LVDD, TVDD,
BVDD, OVDD, GVDD and GND pins of the device.
25.6
Pull-Up and Pull-Down Resistor Requirements
The MPC8568E requires weak pull-up resistors (2–10 k
Ω is recommended) on open drain type pins
including I2C pins and MPIC interrupt pins.
Correct operation of the JTAG interface requires configuration of a group of system control pins as
demonstrated in Figure 75. Care must be taken to ensure that these pins are maintained at a valid deasserted
state under normal operating conditions as most have asynchronous behavior and spurious assertion will
give unpredictable results.
相关PDF资料
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MPC8568EVTANGGA 32-BIT, 800 MHz, RISC PROCESSOR, PBGA1023
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MPC8568ECVTAUJJA 32-BIT, 1333 MHz, RISC PROCESSOR, PBGA1023
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MPC8568E-MDS-PB 功能描述:开发板和工具包 - 其他处理器 MPC8568E FAMILY ADS RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压:
MPC8568EPXAQGG 功能描述:微处理器 - MPU 8568 PB Encrypt 1GHz RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8568EPXAUJJ 功能描述:微处理器 - MPU 8568 PB Encrypt 1.3GHz RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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