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型号： MPC8572EVTAVNE
厂商： Freescale Semiconductor
文件页数： 43/138页
文件大小： 0K
描述： MPU POWERQUICC III 1023FCPBGA
标准包装： 1
系列： MPC85xx
处理器类型： 32-位 MPC85xx PowerQUICC III
速度： 1.5GHz
电压： 1.1V
安装类型： 表面贴装
封装/外壳： 1023-BBGA，FCBGA
供应商设备封装： 1023-FCPBGA（33x33）
包装： 托盘
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
137
Document Revision History
23 Document Revision History
Table 90 provides a revision history for the MPC8572E hardware specification.
Table 90. Document Revision History
Rev.
Number
Date
Substantive Change(s)
5
01/2011
Editorial changes throughout
Updated Table 4, “MPC8572E Power Dissipation,” to include low power product.
In Section 22.1, “Part Numbers Fully Addressed by this Document,” defined PPC as “Prototype” and
changed table headings to say “Package Sphere Type”.
Added Table 86, “Part Numbering Nomenclature—Rev 2.2.1.”
4
06/2010
In Section 18.3, “Pinout Listings,” updated Table 76 showing GPINOUT power rail as BVDD.
Updated Section 14.1, “GPIO DC Electrical Characteristics.”
3
03/2010
In Section 2.1, “Overall DC Electrical Characteristics,” changed GPIO power from OVDD to BVDD.
In Section 22.1, “Part Numbers Fully Addressed by this Document,” added Table 87 for Rev 2.1
silicon.
In Section 22.1, “Part Numbers Fully Addressed by this Document,” updated Table 88 for Rev 1.1.1
silicon.
2
06/2009
In Section 3, “Power Characteristics,” updated CCB Max to 533MHz for 1200MHz core device in
Table 5, “MPC8572EL Power Dissipation.”
In Section 4.4, “DDR Clock Timing,” changed DDRCLK Max to 100MHz. This change was
announced in Product Bulletin #13572.
Clarified restrictions in Section 4.5, “Platform to eTSEC FIFO Restrictions.”
In Table 9, “RESET Initialization Timing Specifications,” added note 2.
Added Section 14, “GPIO.”
In Section 18.1, “Package Parameters for the MPC8572E FC-PBGA,” updated material composition
to 63% Sn, 37% Pb.
In Section 18.2, “Mechanical Dimensions of the MPC8572E FC-PBGA, updated Figure 61 to
correct the package thickness and top view.
In Section 19.1, “Clock Ranges,” updated CCB Max to 533MHz for 1200MHz core device in
Table 77, “MPC8572E Processor Core Clocking Specifications.”
In Section 19.5.2, “Minimum Platform Frequency Requirements for High-Speed Interfaces,”
changed minimum CCB clock frequency for proper PCI Express operation.
Added LPBSE to description of LGPL4/LGTA/LUPWAIT/LPBSE/LFRB signal in Table 76,
“MPC8572E Pinout Listing.”
Corrected supply voltage for GPIO pins in Table 76, “MPC8572E Pinout Listing.”
Applied note to SD1_PLL_TPA in Table 76, “MPC8572E Pinout Listing.”
Updated note regarding MDIC in Table 76, “MPC8572E Pinout Listing.”
Added note for LAD pins in Table 76, “MPC8572E Pinout Listing.”
Updated Table 88, “,Part Numbering Nomenclature—Rev 1.1.1” with Rev 2.0 and Rev 2.1 part
number information. Added note indicating that silicon version 2.0 is available for prototype
purposes only and will not be available as a qualified device.
1
08/2008
In Section 22.1, “Part Numbers Fully Addressed by this Document,” added SVR information in,
Table 88 “Part Numbering Nomenclature—Rev 1.1.1,” for devices without Security Engine feature.
0
07/2008
Initial release.
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相关代理商/技术参数
参数描述
MPC8572LPXARLD 功能描述:微处理器 - MPU CSM SNPB 1067 LOW PWR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572LPXARLE 制造商:Freescale Semiconductor 功能描述:38H R211 NOE SNPB 1067LP - Bulk
MPC8572LPXATLD 功能描述:微处理器 - MPU CSM SNPB 1200 LOW PWR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC8572LPXATLE 制造商:Freescale Semiconductor 功能描述:38H R211 NOE SNPB 1200LP - Bulk
MPC8572LPXAULD 功能描述:微处理器 - MPU CSM SNPB 1333 LOW PWR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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