参数资料
型号: MPC880VR80
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 80 MHz, RISC PROCESSOR, PBGA357
封装: LEAD FREE, PLASTIC, BGA-357
文件页数: 8/87页
文件大小: 1046K
代理商: MPC880VR80
MPC885/MPC880 PowerQUICC Hardware Specifications, Rev. 7
16
Freescale Semiconductor
Layout Practices
Figure 5. Example Voltage Sequencing Circuit
9
Layout Practices
Each VDD pin on the MPC885/MPC880 should be provided with a low-impedance path to the board’s
supply. Each GND pin should likewise be provided with a low-impedance path to ground. The power
supply pins drive distinct groups of logic on chip. The VDD power supply should be bypassed to ground
using at least four 0.1 F by-pass capacitors located as close as possible to the four sides of the package.
Each board designed should be characterized and additional appropriate decoupling capacitors should be
used if required. The capacitor leads and associated printed-circuit traces connecting to chip VDD and
GND should be kept to less than half an inch per capacitor lead. At a minimum, a four-layer board
employing two inner layers as VDD and GND planes should be used.
All output pins on the MPC885/MPC880 have fast rise and fall times. Printed-circuit (PC) trace
interconnection length should be minimized in order to minimize undershoot and reflections caused by
these fast output switching times. This recommendation particularly applies to the address and data buses.
Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the VDD and GND circuits. Pull up all unused inputs or signals that will be
inputs during reset. Special care should be taken to minimize the noise levels on the PLL supply pins. For
more information, please refer to the MPC885 PowerQUICC Family Reference Manual, Section 14.4.3,
“Clock Synthesizer Power (VDDSYN, VSSSYN, VSSSYN1).”
10 Bus Signal Timing
The maximum bus speed supported by the MPC885/MPC880 is 80 MHz. Higher-speed parts must be
operated in half-speed bus mode (for example, an MPC885/MPC880 used at 133 MHz must be configured
for a 66 MHz bus). Table 7 shows the frequency ranges for standard part frequencies in 1:1 bus mode, and
Table 8 shows the frequency ranges for standard part frequencies in 2:1 bus mode.
VDDH
VDDL
1N5820
MUR420
相关PDF资料
PDF描述
MPC885CVR133 32-BIT, 133 MHz, RISC PROCESSOR, PBGA357
MPC885ZP66 32-BIT, 66 MHz, RISC PROCESSOR, PBGA357
MPC885CZP133 32-BIT, 133 MHz, RISC PROCESSOR, PBGA357
MPC880VR66 32-BIT, 66 MHz, RISC PROCESSOR, PBGA357
MPC880CVR133 32-BIT, 133 MHz, RISC PROCESSOR, PBGA357
相关代理商/技术参数
参数描述
MPC880ZP133 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC880ZP66 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC880ZP80 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC885ADS 功能描述:开发板和工具包 - 其他处理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压:
MPC885ADSE 功能描述:开发板和工具包 - 其他处理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: