参数资料
型号: MPDTY124S
厂商: Murata Power Solutions Inc
文件页数: 7/13页
文件大小: 0K
描述: CONV DC/DC 10.8W 1.8VOUT 6A SMT
产品目录绘图: MPDTY1xxS Top
MPDTY1xxS Side 1
MPDTY1xxS Side 2
标准包装: 240
系列: MPD
类型: 非隔离(POL)
输出数: 1
电压 - 输入(最小): 4.5V
电压 - 输入(最大): 5.5V
Voltage - Output 1: 1.8V
电流 - 输出(最大): 6A
电源(瓦) - 制造商系列: 10W
特点: 带有 UVLO
安装类型: 表面贴装
封装/外壳: 12-DIP SMD 模块
尺寸/尺寸: 1.33" L x 0.61" W x 0.24" H(33.8mm x 15.4mm x 6.0mm)
包装: 托盘
工作温度: -40°C ~ 85°C
效率: 93%
电源(瓦特)- 最大: 10.8W
产品目录页面: 2732 (CN2011-ZH PDF)
其它名称: 490-4567
SPEC No. JEPD-0087-00
For Reference Only
12. Reliability
12-1 Humidity
According to JIS-C-0022.
40±2 degreeC, 90 to 95 %RH, 100 hours.
Leave for 4 hours at room temperature.
No damage in appearance and no deviation from electrical characteristics.
12-2 Temperature Cycles
Step
1
2
3
4
Temp.
-40±3°C
at room temp.
+85±3°C
at room temp.
Period.
30 minutes
5 to 10 minutes
30 minutes
5 to 10 minutes
Repeat cycle 5 times.
Leave 2 hours at room temp.
No damage in appearance and no deviation from electrical characteristics.
12-3 Vibration
10 to 55Hz, 1.5mm amplitude, 1 hour for each of X, Y, Z directions.
No damage in appearance and no deviation from electrical characteristics.
12-4 Mechanical Shock
20G, 1 time for each X, Y, Z directions.
No damage in appearance and no deviation from electrical characteristics.
12-5 Soldering Heat Resistance (JIS C 0050)
Immerse lead pins in a solder bath of 260±5 degreeC for 3±0.5s.
Then products under test are left for 2 hours.
No damage in appearance and no deviation from electrical characteristics
12-6 Lead Pin Strength
Strain one lead pin by gradually-increasing to 5.0N along axial direction; maintaining for 5s.
No damage to the lead pin.
12-7 Solderability of Leads
The lead pins will be immersed in the isopropyl alcohol (JIS K 1522) with Rosin (JIS K 5902) solution (the
concentration of Rosin allowed is 10 to 35wt%, and normally approx. 25wt% will be used without any specific
requirement.).
Then the lead pins will be immersed in the solder H63A (JIS Z 3282) solution at the temperature of 230±5 degreeC for
3±0.5 seconds, and pulled up completely.
The solder will adhere to over 75% of immersed area.
13. Packaging Specification
13-1 Packing Form
These are packed in a tray. (See Fig.1)
13-2 The number of products in a package specification are from 40 pcs./tray
If the number of products is a fraction of this increment, packaging may not follow this specification.
13-3 Packaging Form
These trays are packed in a corrugated box by stacking each, alternately, in a 180 ? orientation. (See Fig.2)
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