参数资料
型号: MPL015A2T1
厂商: Freescale Semiconductor
文件页数: 5/8页
文件大小: 0K
描述: IC BAROMETER SPI DGTL MINI 8-LGA
标准包装: 1,000
压力类型: 绝对
工作压力: 50 ~ 115 kPa
端口尺寸: 母型,0.04"(1.02mm)孔
输出: 数字,I²S
电源电压: 2.375 V ~ 5.5 V
端接类型: PCB
工作温度: -40°C ~ 105°C
封装/外壳: 8-TLGA
Pressure
Solder Recommendations
1.
2.
Use SAC solder alloy (i.e., Sn-Ag-Cu) with a melting point of about 217°C. It is recommended to use SAC305
(i.e., Sn-3.0 wt.% Ag-0.5 wt.% Cu).
Reflow
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Ramp up rate: 2 to 3 C/s.
Preheat flat (soak): 110 to 130s.
Reflow peak temperature: 250°C to 260°C (depends on exact SAC alloy composition).
Time above 217°C: 40 to 90s (depends on board type, thermal mass of the board/quantities in the reflow).
Ramp down: 5 to 6 C/s.
Using an inert reflow environment (with O2 level about 5 to 15 ppm).
NOTE: The stress level and signal offset of the device also depends on the board type, board core material, board thickness
and metal finishing of the board.
Handling Recommendations
It is recommended to handle the MPL015A2 pressure sensor with a vacuum pick and place tool. Sharp objects utilized to move
the MPL015A2 pressure sensor increase the possibility of damage via a foreign object/tool into the small exposed port.
The sensor die is sensitive to light exposure. Direct light exposure through the port hole can lead to varied accuracy of pressure
measurement. Avoid such exposure to the port during normal operation.
MPL015A2
Sensors
Freescale Semiconductor
5
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