参数资料
型号: MPLEZW-A1-0000-0000E040F
厂商: Cree Inc
文件页数: 2/14页
文件大小: 1049K
描述: LED EASYWHITE XLAMP 4000K SMD
产品培训模块: XLamp MP-L
标准包装: 500
系列: EasyWhite™, Xlamp® MPL-EZW
颜色: 中性白
电流 - 最大: 3 x 250mA
正向电压: 25V
流明 @ 电流 - 最大: 1365 lm
在特定电流下的光通量 - 测试: 1050 lm
流明/瓦 @ 电流 - 测试: 93 lm/W
电流 - 测试: 3 x 150mA
波长: 4000K
透镜样式/尺寸: 圆形,带圆顶,11mm
视角: 125°
安装类型: 表面贴装
封装/外壳: 6-SMD
包装: 带卷 (TR)
XLAMP MP-L EASYWHITE LEDS
Copyright ? 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.Copyright ? 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree?, the Cree logo, XLamp?
and EasyWhite
?
are
1010
registered trademarks of Cree, Inc.
notes
lumen maintenance Projections
Cree now uses standardized IeS LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LeD
lumen maintenance. For information on the specifc LM-80 data sets available for this LED, refer to the public LM-80
results document at www.cree.com/xlamp_app_notes/LM80_results.
Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_
maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal
Management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal
design, ambient temperature, and drive current affect the LeD junction temperature.
moisture sensitivity
XLamp MP-L easyWhite LeDs are shipped in sealed, moisture-
barrier bags (MBB) designed for long shelf life. If XLamp MP-L
easyWhite LeDs are exposed to moist environments after
opening the MBB packaging but before soldering, damage to
the LeD may occur during the soldering operation. The derating
table at right defnes the maximum exposure time (in days) for
an XLamp MP-L easyWhite LeD in the listed humidity and temperature conditions. LeDs with exposure time longer than
the time specifed below must be baked according to the baking conditions listed below.
Cree recommends keeping XLamp LeDs in their sealed moisture-barrier packaging until immediately prior to use. Cree
also recommends returning any unused LeDs to the resealable moisture-barrier bag and closing the bag immediately
after use.
Baking conditions
It is not necessary to bake all XLamp MP-L easyWhite LeDs. Only the LeDs that meet all of the following criteria must
be baked:
1.
LeDs that have been removed from the original MBB packaging.
2.
LeDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
3.
LeDs that have not been soldered.
LeDs should be baked at 80
oC for 24 hours. LeDs may be baked on the original reels. Remove LeDs from MBB packaging
before baking. Do not bake parts at temperatures higher than 80
oC. This baking operation resets the exposure time as
defned in the Moisture Sensitivity section above.
temp.
maximum Percent relative humidity
30%
40%
50%
60%
70%
80%
90%
35 oC
-
-
-
17
1
.5
.5
30 oC
-
-
-
28
1
1
1
25 oC
-
-
-
-
2
1
1
20 oC
-
-
-
-
2
1
1
相关PDF资料
PDF描述
MPLEZW-A1-0000-0000C027F LED EASYWHITE XLAMP 2700K SMD
MPLEZW-A1-0000-0000D040H LED NEUTRAL WHITE 4000K SMD
VERSAFIT-3/4-KT1-REFILL HEATSHRINK 3/4"X6" 14 PCS BLK
MPLEZW-A1-0000-0000B035H LED WARM WHITE 3500K 700LM SMD
MPLEZW-A1-0000-0000B030H LED WARM WHITE 3000K 700LM SMD
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