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参数资料
型号： MPM22CUC450B
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 450 MHz, MICROPROCESSOR, XMA
封装： MMC-2
文件页数： 34/64页
文件大小： 778K
代理商： MPM22CUC450B
Pentium
III Processor Mobile Module MMC-2
iv
Datasheet
245304-004
5.3.3
Power Planes: Bulk Capacitance Requirements.................................... 34
5.3.4
System Power Supply Protection Guidelines ......................................... 36
5.3.4.1 DC Power System Protection.................................................... 36
5.3.4.2 V_DC Power Supply.................................................................. 37
5.3.4.3 Overcurrent Protection .............................................................. 37
5.3.4.4 Current Limit Shift Point ............................................................ 39
5.3.4.5 Slew Rate Control ..................................................................... 41
5.3.4.6 Undervoltage Lockout ............................................................... 43
5.3.4.7 Overvoltage Lockout ................................................................. 44
5.4
Active Thermal Feedback ................................................................................... 48
5.5
Thermal Sensor Configuration Register.............................................................. 48
6.0
Mechanical Specification.................................................................................................. 49
6.1
Module Dimensions............................................................................................. 49
6.1.1
Pin 1 Location of the MMC-2 Connector ................................................ 49
6.1.2
Printed Circuit Board .............................................................................. 50
6.1.3
Height Restrictions ................................................................................. 51
6.2
Thermal Transfer Plate ....................................................................................... 51
6.3
Module Physical Support .................................................................................... 53
6.3.1
Module Mounting Requirements ............................................................ 53
6.3.2
Module Weight ....................................................................................... 54
7.0
Thermal Specification....................................................................................................... 55
7.1
Thermal Design Power........................................................................................ 55
8.0
Labeling Information.........................................................................................................56
9.0
Environmental Standards................................................................................................. 58
Figures
1
Pentium III Processor Mobile Module Block Diagram ........................................... 3
2
MMC-2 Connector Pad Footprint ........................................................................ 19
3
Clock Control States ........................................................................................... 24
4
BCLK Waveform at the Processor Core Pins ..................................................... 29
5
VR Efficiency Chart ............................................................................................ 31
6
Power Sequence Timing ..................................................................................... 34
7
V_DC Ripple Current .......................................................................................... 36
8
V_DC Power System Protection Block Diagram ................................................. 37
9
Overcurrent Protection Circuit ............................................................................. 38
10
Current Shift Model ............................................................................................. 39
11
Undervoltage Lockout ......................................................................................... 43
12
Undervoltage Lockout Model .............................................................................. 44
13
Overvoltage Lockout ........................................................................................... 45
14
Overvoltage Lockout Model ................................................................................ 45
15
Recommended Power Supply Protection Circuit for the System Electronics ..... 47
16
Simulation of V_DC Voltage Skew ...................................................................... 47
17
Board Dimensions and MMC-2 Connector Orientation ....................................... 49
18
Board Dimensions and MMC-2 Connector—Pin 1 Orientation ........................... 50
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