
3–120
Motorola Sensor Device Data
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Figure 3 illustrates the Differential/Gauge basic chip carrier
(Case 867). A fluorosilicone gel isolates the die surface and
wire bonds from the environment, while allowing the pres-
sure signal to be transmitted to the sensor diaphragm. (For
use of the MPX5500D in a high pressure, cyclic application,
consult the factory.)
The MPX5500 series pressure sensor operating charac-
teristics, and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor perfor-
mance and long–term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0
°
to
85
°
C using the decoupling circuit shown in Figure 4
.
The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
MAX
Figure 2. Output versus Pressure Differential
DIFFERENTIAL PRESSURE (kPa)
5.0
4.0
3.0
2.0
0
550
350
150
0
O
450
250
4.5
3.5
2.5
1.5
50
TRANSFER FUNCTION:
Vout = VS*0.0018*P+0.04)
±
ERROR
VS = 5.0 Vdc
TEMP = 0 to 85
°
C
1.0
0.5
500
300
100
400
200
MIN
TYPICAL
éééééééééééé
éééééééééééé
éééééééééééé
éééééééééééé
FLUORO SILICONE
DIE COAT
LEAD
FRAME
STAINLESS STEEL
METAL COVER
BOND
DIE
EPOXY CASE
WIRE BOND
Figure 3. Cross–Sectional Diagram
(Not to Scale)
P1
Figure 4. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
1.0 F
IPS
470 pF
OUTPUT
Vs
5 V
0.01 F
GND
Vout
F
Freescale Semiconductor, Inc.
n
.