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参数资料
| 型号： | MPX5050 |
| 厂商： | Motorola, Inc. |
| 英文描述： | OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output |
| 中文描述： | 经营概况集成压力传感器0至50 kPa（0至7.25 PSI）的0.2至4.7伏特输出 |
| 文件页数： | 3/10页 |
| 文件大小： | 189K |
| 代理商： | MPX5050 |
3
Motorola Sensor Device Data
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050 series pressure sensor operating charac-
teristics, and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor perfor-
mance and long–term reliability. Contact the factory for in-
formation regarding media compatibility in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the integrated sensor to the A/D input of a microprocessor.
Proper decoupling of the power supply is recommended.
Figure 2 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0
°
to
85
°
C using the decoupling circuit below
.
(The output will sat-
urate outside of the specified pressure range.)
Figure 2. Output versus Pressure Differential
MAX
DIFFERENTIAL PRESSURE (kPa)
5.0
4.0
3.0
2.0
0
55
35
15
0
O
45
25
4.5
3.5
2.5
1.5
5
TRANSFER FUNCTION:
Vout = VS*(0.018*P+0.04)
±
ERROR
VS = 5.0 Vdc
TEMP = 0 to 85
°
C
1.0
0.5
50
30
10
40
20
MIN
TYPICAL
Figure 3. Cross–Sectional Diagram
(Not to Scale)
ééééééééééé
ééééééééééé
ééééééééééé
ééééééééééé
ééééééééééé
P2
FLUORO SILICONE
GEL DIE COAT
WIRE BOND
LEAD FRAME
DIE
STAINLESS STEEL
METAL COVER
EPOXY
PLASTIC
CASE
DIFFERENTIAL/GAUGE ELEMENT
DIE
BOND
μ
PROCESSOR
A/D
51 k
50 pF
MPX5050
OUPUT
(PIN 1)
Figure 4. Typical Decoupling Filter for Sensor to
Microprocessor Interface
P1
相关PDF资料 |
PDF描述 |
|---|---|
| MPX5050D | OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output |
| MPX5050DP | OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output |
| MPX5050GP | OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output |
| MPX5050GS | 16 MEGABIT 3.3 VOLT SERIAL CONFIGURATION - NOT RECOMMENDED for NEW DESIGN |
| MPX50 | 16 MEGABIT 3.3 VOLT SERIAL CONFIGURATION - NOT RECOMMENDED for NEW DESIGN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPX5050_09 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPX5050D | 功能描述:板上安装压力/力传感器 PRES SEN INTEG 50KPA RoHS:否 制造商:Honeywell 工作压力:0 bar to 4 bar 压力类型:Gage 准确性:+ / - 0.25 % 输出类型:Digital 安装风格:Through Hole 工作电源电压:5 V 封装 / 箱体:SIP 端口类型:Dual Radial Barbed, Same sides |
| MPX5050DP | 功能描述:板上安装压力/力传感器 PRES SEN INTEG 50KPA RoHS:否 制造商:Honeywell 工作压力:0 bar to 4 bar 压力类型:Gage 准确性:+ / - 0.25 % 输出类型:Digital 安装风格:Through Hole 工作电源电压:5 V 封装 / 箱体:SIP 端口类型:Dual Radial Barbed, Same sides |
| MPX5050DP | 制造商:Freescale Semiconductor 功能描述:Pressure Sensors IC |
| MPX5050GP | 功能描述:板上安装压力/力传感器 PRES SEN INTEG 50KPA RoHS:否 制造商:Honeywell 工作压力:0 bar to 4 bar 压力类型:Gage 准确性:+ / - 0.25 % 输出类型:Digital 安装风格:Through Hole 工作电源电压:5 V 封装 / 箱体:SIP 端口类型:Dual Radial Barbed, Same sides |
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