参数资料
型号: MPXHZ6115AC6U
厂商: Freescale Semiconductor
文件页数: 4/17页
文件大小: 0K
描述: SENSOR ABS PRESS 16.7PSI MAX
产品目录绘图: MPXH(Z)6(1,2,4)xAC6xx Top
MPXH(Z)6(1,2,4)xAC6xx Side
标准包装: 55
系列: MPXHZ6115
压力类型: 绝对
工作压力: 2.2 ~ 16.7 PSI
端口尺寸: 公型,1/8"(3.175mm)管式
输出: 0 ~ 4.8V
电源电压: 4.75 V ~ 5.25 V
端接类型: PCB
工作温度: -40°C ~ 125°C
封装/外壳: 8-SSOP(0.335",8.50mm 宽),顶部端口
产品目录页面: 2807 (CN2011-ZH PDF)
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
V S
2
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and Ground
Reference
Shift
Circuitry
4
V OUT
GND
3
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
Figure 1. Fully Integrated Pressure Sensor Schematic
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 ? to 85 ? C temperature
range. The output will saturate outside of the rated pressure
range.
Fluorosilicone
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXxx6115A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Gel Die Coat
Wire Bond
P1
Die
Stainless
Steel Cap
Thermoplastic
Case
Lead
Frame
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale)
+5.0 V
V S Pin 2
100 nF
MPXxx6115A
V out Pin 4
to ADC
GND Pin 3
47 pF
51 K
Figure 3. Typical Application Circuit
(Output Source Current Operation)
MPXA6115A
Sensors
4
Freescale Semiconductor, Inc.
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